Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.
Please contact your salesperson for assistance.
Manufacturer Part #
PIC16F15313T-I/SN
PIC16F Series 3.5 kB Flash 256 B RAM 32 MHz 32-Bit Microcontroller - SOIC-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC16F15313T-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Errata for the PIC16(L)F15313/23 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC16(L)F15313/23 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Updated data sheet revision to revision E. Removed Data Sheet Clarifications for previous revision.Impacts to Data Sheet: NoneReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 10 Aug 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
PCN Status: Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF153xx, PIC16LF183xx, PIC16LF184xx, PIC18F04Q4xx, PIC18F05Q4xx and PIC18F06Q4xx device families available in 14L and 8L SOIC (3.90mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Microchip has released a new Product Documents for the PIC16(L)F15313/23 Full-Featured 8/14-Pin Microcontroller Data Sheet of devices. Notification Status: FinalDescription of Change: 1) Updated terminology used throughout the data sheet: ?master? replaced by ?host?, and ?slave? replaced by ?client?2) Replaced ADCRC appearances with FRC.3) Updated Figures 30-1, 30-2, 30-3 and 30-4: CWGxISM replaced with CWG1DAT. Updated Section 1, Tables 4-10, 29-2, 31-2, 31-4, 36-3 and 37-6, and Figures 37-5, 37-9, 37-10, 38-14 and 38-15.4) Minor package corrections.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 16 Feb 2022
Part Status:
Microchip PIC16F15313T-I/SN - Technical Attributes
| Family Name: | PIC16F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 3.5kB |
| RAM Size: | 256B |
| Speed: | 32MHz |
| No of I/O Lines: | 6 |
| InterfaceType / Connectivity: | I2C/LINbus/SPI/UART |
| Peripherals: | Brown-out Detect/POR/PWM/Watchdog |
| Supply Voltage: | 2.3V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| Moisture Sensitivity Level: | 3 |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount