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Référence fabricant
PIC16F1827-E/MV
PIC16F Series 7 KB Flash 384 B RAM 32 MHz 8-Bit Microcontroller - UQFN-28
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :91 par Tube Style d'emballage :UQFN-28 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip PIC16F1827-E/MV - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Revision History: March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.December 17, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add PIC18F46K22-E/MVC01 and PIC18F46K22T-E/MVC01 catalog part numbers. Updated post change mold compound material to NEPL Proprietary. Provided estimated first ship date to be on January 15, 2025.February 11, 2025: Re-issued final notification to include the Lead-frame package at MMT in the post change summary table. March 12, 2025: Issued cancellation notification.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:November 25, 2021: Issued initial notification.November 17, 2023: Issued cancellation notification.PCN Status:Cancellation Notification Description of Change:This qualification was originally performed to qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify A194 lead frame as an additional lead frame material for selected products available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm), and 16L UQFN (3x3x0.5mm) packages.Change Implementation Status:Not applicableEstimated Qualification Completion Date:Not applicable
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Microchip PIC16F1827-E/MV - Caractéristiques techniques
| Family Name: | PIC16F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 7kB |
| RAM Size: | 384B |
| Speed: | 32MHz |
| No of I/O Lines: | 16 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 12-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | UQFN-28 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
91 par Tube
Style d'emballage :
UQFN-28
Méthode de montage :
Surface Mount