Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
PIC16F18424-I/ST
Download the CAD models for this product. Learn more about SnapMagic.
96 per Std. Mfr. Pkg
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: 16-Bit Microcontrollers, 8-Bit Microcontrollers, Capacitive Touch Sensors, USB BridgeNotification Subject: CCB 8412 Final Notice: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound material for selected MCP2221, MCP2221A, MTCH105, PIC16F14xx, PIC16F15xx, PIC16F16xx, PIC16F17xx, PIC16F18xx, PIC16LF15xx, PIC16LF17xx, PIC18F04Qxx, PIC18F05Qxx, PIC18F06Qxx, PIC24F04KA200, PIC24F04KL100 and PIC24F08KL200 device families available in 14L TSSOP (4.4mm) package assembled at MMT site.Description of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound material for selected MCP2221, MCP2221A, MTCH105, PIC16F14xx, PIC16F15xx, PIC16F16xx, PIC16F17xx, PIC16F18xx, PIC16LF15xx, PIC16LF17xx, PIC18F04Qxx, PIC18F05Qxx, PIC18F06Qxx, PIC24F04KA200, PIC24F04KL100 and PIC24F08KL200 device families available in 14L TSSOP (4.4mm) package assembled at MMT site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound material at MMT assembly site. Estimated First Ship Date: 23 October 2026 (date code: 2643
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Errata for the PIC16(L)F18424/44 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change: ? Split existing errata into two documents. This errata will continue to document issues with the PIC16(L)F18424/44 family and its data sheet (DS40002000). Silicon and data sheet issues for the PIC16(L)F18425/45 family (DS40002002) are now documented in Microchip errata DS80001067.? Added new Silicon Revision (A2)? Updated Table.1 - Silicon Device Identification? Added new errata: ? 1.1.2, Double Sample Conversions (ADCC) ? 1.1.3, ADC Conversion Acquisition Time in Sleep (ADCC) ? 1.2.1, Missing Codes with FVR Reference ? 1.3.1, The I2C Start and/or Stop Flags May Be Set When I2C Is Enabled ? 1.4.1, Low-Voltage Programming Not Possible ? 1.6.2, PFM Back to Back Writes ? 1.7.1, Wrong Duty Cycle for CCP Module ? 1.8.1, Reset Bit (SMT) ? 1.9.1, Synchronous Mode Transmissions (USART) ? 1.9.2, Double Byte Transmit (USART) B 11/2020 Added Silicon issue 1.2.2 for Electrical Spec; Other minorImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 21 December 2022
Microchip has released a new Datasheet for the PIC16(L)F18424/44 14/20-Pin Full-Featured, Low Pin Count Microcontrollers Data Sheet of devicesNotification Status: FinalDescription of Change: Revision includes:? General improvement of the documentation and its structure? Added notes in the following sections: ? Section 18.3.2 Timer0 Output ? Section 19.7.6 Timer1 Gate Event Interrupt ? Section 32.1.1 Channel SelectionImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Sep 2022
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
