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Manufacturer Part #
PIC16F882T-I/ML
PIC16F Series 3.5 kB Flash 128 B RAM 20 MHz 8-Bit Microcontroller - QFN-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1600 per Reel Package Style:QFN-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2322 | ||||||||||
Microchip PIC16F882T-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
****FPCN109138 UPDATE****Description of Change: Qualification of CRM1064L as an additional die attach material for selected PIC18F1x, PIC18F2x, PIC18LF2x, PIC16F6x, PIC16LF6x, PIC16F7x, PIC16LF7x, PIC16F8x, PIC16LF8x andPIC16F9x device families available in 28L VQFN (6x6x1.0 mm) package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CRM1064L as an additional die attach material at MTAI assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to FPCN109053 **Revision History:Re-issued initial notification. Updated the qualification plan to include the High Temperature Storage Life (HTSL) test.Description of Change:Qualification of CRM1064L as an additional die attach material for selected PIC18F1x, PIC18F2x, PIC18LF2x, PIC16F5x, PIC16F6x, PIC16LF6x, PIC16F7x, PIC16LF7x, PIC16F8x, PIC16LF8x and PIC16F9x device families available in 28L QFN (6x6x0.9mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying CRM1064L as an additional die attach material at MTAI assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2025
PCN Status:Initial NotificationDescription of Change:Qualification of CRM1064L as an additional die attach material for selected PIC18F1x, PIC18F2x, PIC18LF2x, PIC16F5x, PIC16F6x, PIC16LF6x, PIC16F7x, PIC16LF7x, PIC16F8x, PIC16LF8x and PIC16F9x device families available in 28L QFN (6x6x0.9mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying CRM1064L as an additional die attach material at MTAI assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2025
Microchip has released a new Document for the PIC16F88X Family Silicon Errata and Data Sheet Clarifications of devices.ERRATA - PIC16F88X Family Silicon Errata and Data Sheet ClarificationsNotification Status: FinalDescription of Change:Updated Data Sheet Revision Letter, Host/Client Terminology.Impacts to Data Sheet: NoneReason for Change: To improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Apr 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip PIC16F882T-I/ML - Technical Attributes
| Family Name: | PIC16F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 3.5kB |
| RAM Size: | 128kB |
| Speed: | 20MHz |
| No of I/O Lines: | 24 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 2V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 11-chx10-bit |
| Package Style: | QFN-28 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1600 per Reel
Package Style:
QFN-28
Mounting Method:
Surface Mount