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PIC16LC923-04/L
Download the CAD models for this product. Learn more about SnapMagic.
19 per Tube
PLCC-68
Surface Mount
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Description of Change: Qualification of 3280NP as an additional die attach material for selected PIC16Cxx, PIC17Cxx, PIC18Fxx, PIC18Cxx, A40MX0xx, AT89C5xx, TC7117xx, TC7106xx, TC7107xx, TC850xx, TC7116xx, TC7109xx, PIC16Fxx, AY0438xx, HV518xx, HV5222xx, HV5308xx, HV9308xx, HV9408xx, HV5408xx, TC7129xx, MM5450xx, MM5451xx, ATF150xx, AT80C5xx, AT89LPxx, AT89S5xx, AT89LSxx, AT89S8xx, ATF250xx, AT27BVxx, AT27C2xx, MT8812xx, MT8816xx, MT093xx, HV5122xx, AT27C1xx, AT27C4xx, HV5622xx, HV5630xx, LE58QLxx, ATmega8515, ATF16Lxx, AT17LVxx, ATF16Vxx, TC1443xx, HV5812xx, HV2022xx, HV2301xx, HV2201xx, HV219xx, ATF22Vxx, ATF750xx, MIC58Pxx, MIC59Pxx, MIC580xx, ATF22Lxx, SY100Exx, MT8952xx, MT9171xx, MT9172xx, MT9122xx, MT8808xx, MT8806xx, COM200xx, A42MX2xx, A42MX0xx, A42MX1xx, AT27C0xx, AT27LVxx, AT28C0xx, AT28LVxx, AT28HCxx, AT28C2xx, AT28BVxx, AT28C6xx, AT27C5xx, SST39Sxx, SST39Lxx, SST39Vxx, SST49Lxx and LE79R7xx device families available in various packages.Reason for Change: To improve manufacturability by qualifying 3280NP as an additional die attach material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: June 2026
***UPDATE OF PCN111023***Revision History: February 21, 2025: Issued initial notification.April 24, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on May 29, 2026. Added "97K technology" in the notification subject. Added column "Change (Yes/No)" in the pre and post change table. Revised affected parts list to remove PIC16C55804I/SOVAO, PIC16C72-04I/SOVAO and PIC16C711T-04I/SSVAO catalog part numbers due to EOL. Product Category: 8-Bit Microcontrollers, KEELOQ? Decoder DevicesDescription of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for CS500, PIC12C509, PIC12C508, PIC16C62A, PIC16C73A, PIC16C711, PIC16C620, PIC16C662, PIC16C72, PIC16C66, PIC16C715, PIC14000, PIC16C923, PIC16C622, PIC17C44, PIC16C64A, PIC16C65A, PIC16C67, PIC16C54A, PIC16C710, PIC16C76, PIC16C77, PIC16C74A, PIC16C63, PIC16C621, PIC17C43, PIC17C42A, PIC16C554, PIC16C924, PIC16C558,PIC16C642, and PIC16LV54A device families of 97K technology in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 29 May 2026 (date code: 2622)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for CS500,PIC12C509, PIC12C508, PIC16C62A, PIC16C73A, PIC16C711, PIC16C620, PIC16C662, PIC16C72, PIC16C66, PIC16C715, PIC14000, PIC16C923, PIC16C622, PIC17C44, PIC16C64A, PIC16C65A, PIC16C67, PIC16C54A, PIC16C710, PIC16C76, PIC16C77, PIC16C74A, PIC16C63, PIC16C621,PIC17C43, PIC17C42A, PIC16C554, PIC16C924, PIC16C558, PIC16C642, and PIC16LV54A in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: November 2025
Part Status:
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