
Manufacturer Part #
PIC16LF72-I/ML
PIC16 Series 3.5 KB Flash 128 B RAM 20 MHz 8-Bit Microcontroller - QFN-28
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Mfr. Name: | Microchip | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:61 per Tube Package Style:QFN-28 Mounting Method:Surface Mount | ||||||||||
Date Code: | 2008 |
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site Estimated First Ship Date:June 24, 2018 (date code:1826)
Revision History:January 16, 2018: Issued initial notification.April 26, 2018: Issued final notification. Attached is the qualification report. Provided estimated first ship date to be on May 26, 2018. Description of Change:Qualification of MMT as an additional site for selected products of 150K and 160K wafer technologies available in 44 QFN (8x8mm), 28L QFN-S(6x6mm), 28L QFN(6x6mm), 20L QFN (4x4mm), 16L QFN((4x4mm) and 16L QFN(3x3mm) packages. Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date:May 26, 2018(date code: 1821)
Revision History:April 24, 2016: Issued initial notification.February 27, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on March 27, 2018.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 150K and 160K wafer technology available in 28L QFN package at NSEB assembly site.Pre Change: Using gold (Au) bond wire, 8200T and 8600 die attach and G770HCD and G700LTD mold compound material.Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach and G700LTD mold compound material.Reason for Change:To improve manufacturability and qualify CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:March 27, 2018 (date code: 1813)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages..Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:April 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages.Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT as an additional assembly site for selected products of 150K and 160K wafer technologies available in 28L QFN-S, 16L, 20L, 28L and 44L QFN packages.Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Product Lifecycle:
Technical Attributes
Family Name: | PIC16 |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 3.5kB |
RAM Size: | 128B |
Speed: | 20MHz |
No of I/O Lines: | 22 |
InterfaceType / Connectivity: | I2C/SPI |
Peripherals: | I2C/On-Chip-ADC/PWM/SPI/Watchdog |
Number Of Timers: | 3 |
Supply Voltage: | 2V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 5-chx8-bit |
Watchdog Timers: | 1 |
Package Style: | QFN-28 |
Mounting Method: | Surface Mount |
Features & Applications
The PIC16LF72-I/ML is a part of PIC16LF series Microcontroller. It has an operating temperature ranging from -40ºC to +125ºC. It comes in QFN-28 package.
The PIC16F72 features 5 channels of 8-bit Analog-to-Digital (A/D) converter with 2 additional timers, capture/compare/PWM function and the synchronous serial port can be configured as either 3-wire Serial Peripheral Interface (SPI™) or the 2-wire Inter-Integrated Circuit (I²C™) bus. All of these features make it ideal for more advanced level A/D applications in automotive, industrial, appliances and consumer applications
Features:
- High Performance RISC CPU:
- Only 35 single word instructions to learn
- All single cycle instructions except for program branches, which are two-cycle
- Operating speed:
- DC - 20 MHz clock input
- DC - 200 ns instruction cycle
- Peripheral Features:
- High Sink/Source Current: 25 mA
- Timer0: 8-bit timer/counter with 8-bit prescaler
- Timer1: 16-bit timer/counter with prescaler, can be incremented during SLEEP via external crystal/clock
- Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler
- CMOS Technology:
- Low power, high speed CMOS FLASH technology
- Fully static design
- Wide operating voltage range: 2.0 V to 5.5 V
- Industrial temperature range
- Special Microcontroller Features:
- 1,000 erase/write cycle FLASH program memory typical
- Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
- Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation
- Programmable code protection
Available Packaging
Package Qty:
61 per Tube
Package Style:
QFN-28
Mounting Method:
Surface Mount