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Manufacturer Part #
PIC16LF872-I/SP
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15 per Tube
SDIP-28
Through Hole
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PCN Information:
***UPDATE OF PCN11074, PCN120405***Revision History: February 24, 2025: Issued initial notification.April 11, 2026: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on May 15, 2026.May 15, 2026: Re-issued final notification to update the Qual Report.Product Category: 8-Bit Microcontrollers, Interface- Infrared Products, KEELOQ? Encoder DevicesDescription of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Estimated First Ship Date: 15 May 2026 (date code: 2620)
***UPDATE OF PCN111074***Revision History: February 24, 2025: Issued initial notification.April 11, 2026: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on May 15, 2026.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 15 May 2026 (date code: 2620)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Part Status:
The PIC16LF872-I/SP is a part of PIC16LF series Microcontroller. It has an operating temperature ranging from -40ºC to +125ºC. It comes in SDIP-28 package.
The PIC16F872 features 64 bytes of EEPROM data memory, self programming, an ICD, 5 channels of 10-bit Analog-to-Digital (A/D) converter, 2 additional timers, a capture/compare/PWM functions and the synchronous serial port can be configured as either 3-wire Serial Peripheral Interface (SPI™) or the 2-wire Inter-Integrated Circuit (I²C™) bus. All of these features make it ideal for more advanced level A/D applications in automotive, industrial, appliances and consumer applications.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.