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PIC18F16Q40-I/P
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22 per Tube
PDIP-20
Surface Mount
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Description of Change:Added silicon issue 1.8.1; updated DS revision letter.Reason for Change: To Improve ProductivityDate Document Changes Effective: 28 Mar 2025
Description of Change:Updating Electrical Specifications chapter, adding 20-Lead VQFN 2LX package, and minor editorial changes.Reason for Change: To Improve ProductivityDate Document Changes Effective: 25 Feb 2025
Microchip has released a new Datasheet for the PIC18F06/16Q40 Microcontroller Data Sheet of devices.Notification Status: FinalDescription of Change:Updating Electrical Specifications chapter, adding 20-Lead VQFN 2LX package, and minor editorial changes.Impacts to Data Sheet: See above detailsReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 02 Sep 2024
Microchip has released a new Errata for the PIC18F06/16Q40 Silicon Errata and Data Sheet Clarifications of devices.Description of Change:Adding Silicon Revision B1. Adding silicon errata 1.3.3, 1.3.4, 1.3.5, 1.3.6, 1.3.7, 1.3.8 and 1.7.1.
Description of Change: Final data sheet; adding characterization graphs.Reason for Change: To Improve Productivity
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected PIC18F27Q8x, PIC18F47Q8x, PIC18F16xQ4x, PIC18F26Qxx and PIC18F46Q71 device families available in 20L (.300in) & 40L (.600in) PDIP and 28L (.300in) SPDIP packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.