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PIC18F16Q41-I/P
Download the CAD models for this product. Learn more about SnapMagic.
22 per Tube
PDIP-20
Through Hole
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Notification Subject: PIC18F06/16Q41 Silicon Errata and Data Sheet ClarificationsDescription of Change:Microchip has released a new Document for the PIC18F06/16Q41 Silicon Errata and Data Sheet Clarifications of devices.Added silicon errata issue 1.10.1.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 May 2026
Description of Change:Microchip has released a new Document for the PIC18F06/16Q41 Silicon Errata and Data Sheet Clarifications of devices. Added silicon errata issue 1.9.1; added DS Clarifications 2.1; updated DS revision letter.Reason for Change: To Improve ProductivityDate Document Changes Effective: 14 Mar 2025
Microchip has released a new Datasheet for the PIC18F04/05/14/15Q41 14/20-Pin, Low-Power, High-Performance Microcontroller with XLP Technology Data Sheet of devices. Notification Status: FinalDescription of Change:Updated Op Amp electrical specifications table, added 2LX package and minor editorial updates.Impacts to Data Sheet: See above detailsReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 02 Aug 2024
Description of Change:Update electrical specification table for the OPA module and minor editorial changes.Reason for Change: To improve productivityData Sheet Link: https://www.microchip.com/mymicrochip/filehandler.aspx?documentid=8c36c0a8-3d4a-4e1f-a4b2-035b08935477
Microchip has released a new Errata for the PIC18F06/16Q41 Silicon Errata and Data Sheet Clarifications of devices.Description of Change:Adding Silicon Revision B1. Adding silicon errata items 1.3.3, 1.3.4, 1.3.5, 1.3.6, 1.3.7, 1.3.8 and 1.8.1.
Description of Change: Added Characterization graphs; updated Tables 48-8, 48-15, and packaging information.Reason for Change: To Improve Productivity
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected PIC18F27Q8x, PIC18F47Q8x, PIC18F16xQ4x, PIC18F26Qxx and PIC18F46Q71 device families available in 20L (.300in) & 40L (.600in) PDIP and 28L (.300in) SPDIP packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.