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PIC18F16Q41-I/SS
Download the CAD models for this product. Learn more about SnapMagic.
67 per Tube
SSOP-20
Surface Mount
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Product Category: 16-Bit Microcontrollers, 32-Bit Microcontrollers, 8-Bit Microcontrollers, Capacitive Touch Sensors, USB BridgeDescription of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected PIC32CMx, PIC18F2xx, PIC16F15xx, PIC16LFxx, PIC16F723xx, PIC16F722xx, MTCH6102xx, PIC16F721xx, PIC16F720xx, AR1100Txx, PIC24FVxx, PIC24F32xx, PIC24F16xx,PIC24F08xx, PIC24FV32xx, PIC32CM640xx, PIC16F18xx, AVR64Dxx, PIC16F17xx, AVR32Dxx, AVR16Dxx, PIC18F1xx, ACE15345xx, PIC18LF13Kxx, PIC24F04KAxx, AVR128Dxx, MTCH108xx, AVR32SDxx, HA2022xx, HA2525xx, MCP2200xx, MCP2210xx, HA1127xx, PIC16F19xx, HA1839xx, PIC16F726xx, PIC16F16xx, C0001RIC00xx, PIC16F1459xx, HA1018xx, HA0130xx, PIC18LF23Kxx device families available in 28 and 20L SSOP (.209in) packages at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Estimated Qualification Completion Date: August 2026
Notification Subject: PIC18F06/16Q41 Silicon Errata and Data Sheet ClarificationsDescription of Change:Microchip has released a new Document for the PIC18F06/16Q41 Silicon Errata and Data Sheet Clarifications of devices.Added silicon errata issue 1.10.1.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 May 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Microchip has released a new Document for the PIC18F06/16Q41 Silicon Errata and Data Sheet Clarifications of devices. Added silicon errata issue 1.9.1; added DS Clarifications 2.1; updated DS revision letter.Reason for Change: To Improve ProductivityDate Document Changes Effective: 14 Mar 2025
Microchip has released a new Datasheet for the PIC18F04/05/14/15Q41 14/20-Pin, Low-Power, High-Performance Microcontroller with XLP Technology Data Sheet of devices. Notification Status: FinalDescription of Change:Updated Op Amp electrical specifications table, added 2LX package and minor editorial updates.Impacts to Data Sheet: See above detailsReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 02 Aug 2024
Description of Change:Update electrical specification table for the OPA module and minor editorial changes.Reason for Change: To improve productivityData Sheet Link: https://www.microchip.com/mymicrochip/filehandler.aspx?documentid=8c36c0a8-3d4a-4e1f-a4b2-035b08935477
Microchip has released a new Errata for the PIC18F06/16Q41 Silicon Errata and Data Sheet Clarifications of devices.Description of Change:Adding Silicon Revision B1. Adding silicon errata items 1.3.3, 1.3.4, 1.3.5, 1.3.6, 1.3.7, 1.3.8 and 1.8.1.
Description of Change: Added Characterization graphs; updated Tables 48-8, 48-15, and packaging information.Reason for Change: To Improve Productivity
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