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Manufacturer Part #
PIC18F2585-I/SO
PIC18 Series 48 kB Flash 3328 B RAM 40 MHz 8-Bit Microcontroller - SOIC-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube Package Style:SOIC-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:1) Updated Sections 16.4.6, 17.3.3, 23.6.1, and 27.2; and Table 27-24.2) Removed Preliminary watermark.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityDate Document Changes Effective: 04 Oct 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
Notification subject: CCB 3217 and CCB 3217.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePre Change: Using palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wireChange Implementation Status: In ProgressEstimated First Ship Date: September 16, 2018 (date code: 1838)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability codeRevision History: March 08, 2018: Issued initial notification.August 16, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on September 16, 2018. The change described in this PCN does not alter Microchip's
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly site.Pre Change: Using palladium coated copper wire (PdCu) bond wire.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire Estimated Qualification Completion Date:April 2018
Product Lifecycle:
Technical Attributes
| Family Name: | PIC18 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 48kB |
| RAM Size: | 3328B |
| Speed: | 40MHz |
| No of I/O Lines: | 22 |
| InterfaceType / Connectivity: | CAN/I2C/SPI/UART |
| Peripherals: | HLVD/POR/PWM/Watchdog |
| Number Of Timers: | 1 |
| Supply Voltage: | 2V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 8-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SOIC-28 |
| Mounting Method: | Surface Mount |
Features & Applications
Features:
- ECAN
- NanoWatt Features
- Internal Oscillator
- Self-Programming
- 40 MHz Max Speed
- LIN USART
Available Packaging
Package Qty:
27 per Tube
Package Style:
SOIC-28
Mounting Method:
Surface Mount
