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Manufacturer Part #
PIC18F27J13-I/ML
PIC18F Series 128 kB Flash 3.8 kB RAM 48 MHz 8-Bit Microcontroller - QFN-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:61 per Tube Package Style:QFN-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2013 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 28L QFN (6x6x0.9mm) package at NSEB assembly site.Pre Change: Using gold (Au) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wire.Reason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:January 20, 2019 (date code: 1903)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 28L QFN-S, 64L, 44L and 28L QFN packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu).Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated First Ship Date:July 25, 2018(date code: 1830)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site Estimated First Ship Date:June 24, 2018 (date code:1826)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages..Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:April 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages.Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 64L,28L QFN-S, 44L and 28L packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu). Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated Qualification Completion Date: April 2018
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| Family Name: | PIC18 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 3.8kB |
| Speed: | 48MHz |
| No of I/O Lines: | 22 |
| InterfaceType / Connectivity: | I2C/SPI/USART |
| Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
| Number Of Timers: | 8 |
| Supply Voltage: | 2.15V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 10-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | QFN-28 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
61 per Tube
Package Style:
QFN-28
Mounting Method:
Surface Mount
