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PIC18F56Q71-E/6LX
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61 per Tube
VQFN-48
Surface Mount
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Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected PIC18F2xx, PIC18F5xx, AVR64DDxx, AVR64DUxx, AVR16DDxx, AVR32DDxx, AVR16DUxx, AVR32DUxx, PIC32CMxx, PIC16F7xx, PIC16F1xx, AVR128DA48S, AVR32DA48S and AVR64DA48S device families, together with qualification of MTAI as an additional assembly site for PIC18F4xx, PIC18F5xx, AVR64DBxx, AVR32DBxx, AVR32SDxx, PIC32CMxx, PIC16F1xx, PIC18F2xx, AVR128DA48, AVR32DA48 and AVR64DA48 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and MTAI as an additional assembly site.
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Added Silicon Revision A4. Added silicon errata 1.1.3, 1.6.7-1.6.9,1.7.1, and 1.8.1. Microchip has released a new Document for the PIC18F26/46/56Q71 Silicon Errata and Data Sheet Clarifications of devices. If you are using one of these devices please read the document located at PIC18F26/46/56Q71 Silicon Errata and Data Sheet Clarifications.Reason for Change: To improve productivity.
Description of Change:Corrected the x-axis label on figures 51-90, 51-92, 51-97, 51-98, 51-100, 51-102, and 51-104 in ADC graph section; Updated figures 51-73, 51-75, 51-77 in I/O graph section; Added ADC Charge Pump information; Other minor graph corrections.Reason for Change: To improve productivity.
Microchip has released a new Datasheet for the PIC18F26/46/56Q71 28/40/44/48-Pin, Low-Power, High-Performance Microcontroller with XLP Technology Data Sheet of devices.Description of Change:Added DC and AC Characteristics Graphs and Tables; Updated Electrical Specifications; Minor editorial corrections. Reason for Change: To Improve Productivity
Microchip has released a new Errata for the PIC18F26/46/56Q71 Silicon Errata and Data Sheet Clarifications of devices. If you are using one of these devices please read the document located at PIC18F26/46/56Q71 Silicon Errata and Data Sheet Clarifications.Notification Status: FinalDescription of Change: Adding Silicon Revision A3. Adding silicon errata 1.1.2, 1.6.1-1.6.6.Impacts to Data Sheet: NoneChange Implementation Status: CompleteEstimated First Ship Date: 28 Aug 2023NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts. Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new Datasheet for the PIC18F24/25Q71 28-Pin, Low-Power, High-Performance Microcontroller with XLP Technology Data Sheet of devices.Description of Change: Updated Terminology and Packaging Information.Reason for Change: To Improve Productivity
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.