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Manufacturer Part #
DSPIC33CK256MP605-I/PT
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250 per Tray
TQFP-48
Surface Mount
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PCN Information:
Product Category: 32-Bit Microcontrollers, Digital Signal ControllersNotification Subject: CCB 8307 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected various device families available in 48L TQFP (7x7x1mm), 64L TQFP (10x10x1mm), 80L TQFP (12x12x1mm) and 100L TQFP (12x12x1mm) packages at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected various device families available in 48L TQFP (7x7x1mm), 64L TQFP (10x10x1mm), 80L TQFP (12x12x1mm) and 100L TQFP (12x12x1mm) packages at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: June 2026
Product Category: Digital Signal ControllersDescription of Change:? Sections:? Updated High-Resolution PWM with Fine Edge Placement, Communication Interfaces, Referenced Sources, 2.6. External Oscillator Layout Guidance, 3.3. Data Space Addressing, 4.2. Data Address Space, 5.4. ECC Fault Injection, 6. Resets, 6.1.1. Key Resources, 10.1.1. Source and Destination, 14.1. Overview, 18. Inter-Integrated Circuit (I2C), 19. Parallel Master Port (PMP), 22.1. Time Base Generator, 29. Power-Saving Features, 29.5.1. Key Resources, 30.6. Brown-out Reset (BOR), 30.8. JTAG Interface and 30.9. In-Circuit Debugger.FOR MORE DESCRIPTION CHANGES REFER TO SPCN DOCUMENT ATTACHEDReason for Change: To Improve Productivity Date Document Changes Effective: 30 Apr 2026
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
