Manufacturer Part #
Microprocessors - MPU ARM926 MPU,BGA,IND TEMP,T&R
Microchip has released a new Product Documents for the SAM9X60 Datasheet of devices.Description of Change: 1) Added automotive content in Features, Electrical Characteristics, Ordering Information and Product Identification System2) Reset Controller (RSTC): Added NRST_OUT content3) Debug Unit (DBGU): Updated ICE Access Prevention4) Slow Clock Controller (SCKC): Updated Embedded Characteristics5) Power Management Controller (PMC): a) Updated General Clock Distribution Block Diagram b) PMC_PLL_UPDT: corrected STUPTIM field size6) DMA Controller (XDMAC): a) Transfer Hierarchy Diagrams: removed XDMAC Peripheral Transfer Hierarchy figure b) Added Peripheral to Memory Transfer and Memory to Peripheral Transfer7) LCD Controller (LCDC): a) Embedded Characteristics: updated Output mode content b) Updated YUV Frame Buffer Memory Mapping c) Renamed and updated Window Size table8) 2D Graphics Engine (GFX2D): a) BLEND_WD0: added DREG field b) BLEND_WD5: replaced DFACT and SFACT by DCFACT and SCFACT, respectively; added DPRE, DAFACT, SPRE and SAFACT fields c) GFX2D_GC: removed bits CGDISCORE, CGDISAXI, CGDISFIFO9) USB Host High Speed Port (UHPHS): Corrected reset values for: a) UHPHS_HCSPARAMS b) UHPHS_HCCPARAMS c) UHPHS_PORTSCx10) Image Sensor Interface (ISI): a Added write-protection content b) ISI_CFG2: updated RGB_SWAP and RGB_CFG bit descriptions c) ISI_Y2R_SET1: updated Yoff, Croff and Cboff bit descriptions d) ISI_R2Y_SET0: updated Roff bit description e) ISI_R2Y_SET1: updated Goff bit description f) ISI_R2Y_SET2: updated Boff bit description11) Timer Counter (TC): a) Updated: Embedded Characteristics, Interrupt Sources b) Removed unrequired fault output content12) Triple Data Encryption Standard (TDES): Updated TDES_MR13) Electrical Characteristics: Updated Table 58-57 (CPU clock (HCLK) row)Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 14 Sep 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the SAM9X60 Device Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: 1) Updated 4.1 OTPC Limited Number of Packets2) Added 2.1 Secure Boot Mode: AES-RSA X.509 Certificate Serial Number Length LimitImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 14 Sept 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the SAM9X60 Datasheet of devices.Description of Change: Added Microchip Recommended Power Management Solutions.Reason for Change: To Improve Productivity Date Document Changes Effective: 23 July 2020NOTE: Please be advised that this is a change to the document only the product has not been changed
Notification Status: FinalDescription of Change:1. All section: Changes: Changed order of bits (now from MSB to LSB) in Register Summary tables2. Safety and Security Features Removed section: "Classical Advanced Software Crypto Library (CASCL)" from Security Features table3. Peripherals section: Updated FLEXCOM Features table4. Boot Strategies section: Updated NAND Flash Boot: NAND Flash Detection introduction OTP Memory Controller (OTPC) OTPC_CR: updated READ bit description5. Clock Generator section: Updated Main Clock (MAINCK) Block Diagram6. Power Management Controller (PMC) section: Updated General Clock Distribution Block Diagram and List of write-protected registers in Register Write Protection. PMC_CPU_CKR: corrected MDIV field width7. External Bus Interface (EBI) section: Updated Multi-Port DDR and SDRAM Controllers8. AHB Multiport DDR-SDRAM Controller (MPDDRC) section: DDR2-SDRAM Initialization: added TRFC constraint content. Monitor: added monitor use example. Updated: Quality Of Service Arbitration, Description, Change Frequency During Self-Refresh Mode with Low-power DDR-SDRAM Devices.9. Flexible Serial Communication Controller (FLEXCOM) section: Added introduction in USART FIFO Mode Register. USART FIFO Level Register, USART FIFO Interrupt Mask Register. SPI Status Register, SPI FIFO Mode Register, SPI FIFO Level Register, TWI FIFO Mode Register, TWI FIFO Level Register, TWI FIFO Status Register and TWI FIFO Interrupt Mask Register. Updated: Figure TWI Read Operation with Multiple Data Bytes + Write Operation with Multiple Data Bytes (Sr), TWI Clock Waveform Generator Register (CLDIV and CHDIV bit descriptions), Modes of Operation, TWI Compatibility with I2C Standard and TWI/SMBus Characteristics (Fast Mode Plus and High Speed Modes)10. Image Sensor Interface (ISI) Power Management section: added note11. Timer Counter (TC)section: Embedded Characteristics: corrected number of channels, Block Diagram: added Note 2, TC_SRx: corrected SECE bit position12. Advanced Encryption Standard (AES) section: Updated Operating Modes, AES_MR (OPMOD field description) and AES_IVRx (IV field description)13. Secure Hash Algorithm (SHA)section: SHA_MR: updated ALGO bit field description14. True Random Number Generator (TRNG)section TRNG_PKBCR section: updated KSLAVE field description15. Electrical Characteristics section: Updated Electrical Parameters Usage, Recommended Power Supply Sequencing introduction, ULP0 Operation and ULP1 Operation sequences of operation, Table Main RC Oscillator Characteristics and Figure Current Measurement for Applicative Use Cases16. Mechanical Characteristics section: Updated 228-ball TFBGA Mechanical Characteristics19. Marking section: Updated Line 4 descriptionReason for Change: To Improve ProductivityDate Document Changes Effective: 18 February 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
ERRATA - SAM9X60 Device Silicon Errata and Data Sheet Clarification Microchip has released a new Product Documents for the SAM9X60 Device Silicon Errata and Data Sheet Clarification of devices.Description of Change: First issue.Reason for Change: To Improve ProductivityPlease be advised that this is a change to the document only the product has not been changed.