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SAM9X60T-V/DWB
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1500 par Reel
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Description of Change:Added Boot failure on e.MMC memoriesReason for Change: To improve productivity.Date Document Changes Effective: 04 Jun 2025
Microchip has released a new Datasheet for the SAM9X60 Data Sheet of devices.Notification Status: FinalDescription of Change:Global? Added content related to the SAM9X60 Series high density package devices (SAM9X60(T)-V/6GW)? Added content related to Software License Level (SLx)? Data sheet format reworkedPackage and PinoutUpdated Figure 8.1, Table 8.2Peripheral IdentifiersUpdated Table 12.1External Bus Interface (EBI)Added Device (FPGA, Static Memory, etc.) on NCS0, DDR on NCS1 and NAND Flash on NCS2Debug Unit (DBGU)Chip Identifier: updated reset value informationOTP Memory Controller (OTPC)OTPC_MR: corrected KBDST field widthDDR-SDRAM Controller (MPDDRC)Updated Security and Safety Analysis and ReportsMPDDRC_WPSR: updated SEQE descriptionShutdown Controller (SHDWC)SHDW_MR: removed AUTOLPMDebug Unit (DBGU)DBGU_CIDR Simplified: updated reset valuePower Management Controller (PMC)PMC_PLL_UPDT: updated PLL ID definitionInter-IC Sound Multi-Channel Controller (I2SMCC)Updated Figure 49.7TDM Reception and Transmission Sequence: added noteI2SMCC_MRA: updated TDMFS descriptionSynchronous Serial Controller (SSC)Updated Embedded Characteristics (added ?Up to 16 Channels in TDM Mode?)Added Audio Sampling Rate LimitationsFlexible Serial Communication Controller (FLEXCOM)Updated Baud Rate Generator, Baud Rate in Synchronous Mode, FIFO Overflow/Underflow Error, FIFO Overflow/Underflow Error, FIFO Overflow/Underflow ErrorUpdated TXFPTEF and RXFPTEF definitions in FLEX_US_FESR, FLEX_SPI_SR, FLEX_TWI_FSRAdded note in FLEX_US_FIDI (LON_MODE), FLEX_US_LONB1TX, FLEX_US_LONB1RX, FLEX_US_IDTTX, FLEX_US_IDTRXFLEX_SPI_MR: added LSBHALFAdded detail on WPEN in FLEX_TWI_SMBTRUSB Device High Speed Port (UDPHS)Updated Transfer Without DMAThroughout, corrected number of DMA channels from 7 to 6Analog-to-Digital Controller (ADC)Updated Table 67.4ADC_SEQR2: updated USCHx field widthElectrical CharacteristicsAdded Table 68.6, Table 68.7Updated Figure 68.15Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity
Microchip has released a new Document for the SAM9X60 Device Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change:Throughout:? ?Silicon revision A0? now referred to as ?Device revision A2?? ?Silicon revision A1? now referred to as ?Device revision A1?Added:? Card Detect on SDMMC not functional? RSTC_SR.RSTTYP not showing GENERAL_RST? SPLIP mode does not work with some header sizesData Sheet Clarifications: removed ?OTPC Dependency to Main RC Oscillator? issueImpacts to Data Sheet: NoneReason for Change: To Improve Productivity
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Microchip has released a new Datasheet for the SAM9X60 - Ultra-Low Power Arm? ARM926EJ-S? Processor-Based MPU, 600 MHz, Camera, LCD, 2D Graphics, Dual 10/100 Ethernet, CAN, USB, QSPI, FLEXCOMs, AES, SHA of devices.Description of Change: Global Editorial changes throughoutReference Document Added.Reason for Change: To Improve Productivity
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