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Manufacturer Part #
LTST-C281KGKT
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5000 per Reel
Surface Mount
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Description of Change: Lite-On will be introducing additional dice materials for chip LED and the affected part numbers Reason for Change: In an attempt to mitigate any potential risk to supply continuity, Lite-On has proactively identified alternative bill of materials to improve upon its current sources. The alternative dices have been qualified in Lite-On materials pool. Effective date: Dec. 31st, 2026
Description of Change:Lite-On would like to unify the diameter of the bond wire to 0.8mil for ChipLED products listed below.Reason of Change:For materials management, Liteon would like to unify wire materials for ChipLED products. Lite-On?s existing internal qualification process has implemented for the alternative material to ensure the devices meet Lite-On?s quality and reliability requirements.Effective Date of Change:The wire material will be used from Nov. 1st, 2024.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
