Manufacturer Part #
CYUSB3014-BZXI
EZ-USB FX3 Series ARM9 512K 1.15V to 1.25V External Program Memory IC FBGA-121
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:168 per Tray Package Style:FBGA-121 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2513 | ||||||||||
Product Specification Section
Infineon CYUSB3014-BZXI - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
3A991.a.2
This item may be subject to export licensing controls.
PCN Information:
File
Date
Packaging Process Change
08/14/2025 Details and Download
Description:Extension of total storage time of Finished Goods to 5 years for SMD (Surface Mount Devices) and WLCSP (Wafer Level Chip-Scale Package) packagesReason Infineon able to improve our Finished Goods storage from 2 years to 5 years without having any impact to quality and performance.Intended start of delivery - 2025-09-30
Labeling Change
02/11/2025 Details and Download
Labeling Change
12/14/2023 Details and Download
Part Status:
Active
Active
Infineon CYUSB3014-BZXI - Technical Attributes
Attributes Table
| Data Rate: | 4bps |
| Supply Voltage: | 1.15V to 1.25V |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Interface Type: | I2C |
| Frequency: | 33MHz |
| Moisture Sensitivity Level: | 3 |
| Package Style: | FBGA-121 |
| Mounting Method: | Surface Mount |
Pricing Section
Global Stock:
336
USA:
336
On Order:
0
Factory Lead Time:
13 Weeks
Quantity
Unit Price
168+
$24.72
Product Variant Information section
Available Packaging
Package Qty:
168 per Tray
Package Style:
FBGA-121
Mounting Method:
Surface Mount