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Manufacturer Part #
BGA725L6E6327FTSA1
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15000 per Reel
Surface Mount
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***UPDATE to Future PCN114683***SPCN# 2025-001-ADelta to previous revision:Additional affected product BGA 725L6Description:Current wafer bumping location at Amkor Advanced Technology Taiwan Inc. will be discontinued. Qualified wafer bumping location at Amkor Assembly & Test (Shanghai) Co., Ltd. will be introduced.Reason:Infineon?s partner, Amkor Taiwan, announced discontinuation of 200 mm wafer bumping plant by end of 2025.The wafer bumping of the affected products will be transferred to Amkor China, to assure continuity of supply.Intended start of delivery 2026-01-31
Detailed change information:Subject:Introduction of new packing method affecting dedicated TSLP packages packed at Infineon Technologies (Malaysia) Sdn. Bhd.Reason: Process enhancements to attain customer requirement.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.