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Manufacturer Part #
BM23SPKS1NB9-0B02AA
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63 per Tray
Surface Mount
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Product Category: Bluetooth Module, Bluetooth SiliconDescription of Change: Qualification of MTAI as an additional assembly site for selected BM64, RN4678, BM83, BM23, BM71, BM78, RN4870, BM62, RN4871, BM20, BM70 and BM62SPKS1MC2 device families available in various module packages.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.Estimated First Ship Date: 31 October 2026 (date code: 2644)
Product Category: Bluetooth Module, Bluetooth Silicon, Wireless ModulesDescription of Change: Qualification of MTAI as an additional final test site for selected ATZBRF233, BM78, BM23, RN4871, BM71, BM83, BM20, RN4678, BM62SPKS1MC2, BM62, BM64, RN4870 and BM70 device families available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
Product Category: Bluetooth ModuleDescription of Change: Qualification of U08D as a new fabrication location of Die #2 of catalog part number AT24C64D-XHM-T available in 8L TSSOP (4.4mm) used in the U2 component of BM23SPKS1NB9-YBN3AA, BM23SPKS1NB9-0B02AA, BM23SPKS1NB9-YB03AA, BM23SPKS1NB9-YB02AA, BM23SPKA1NB9-0B02AA, BM23SPKS1NB9-LB01AA, BM23SPKS1NB9-YB01AA, BM23SPKS1NB9-0001AA and BM23SPKA1NB9-0001AA catalog part numbers (CPN) available in 43L MODULE (15x29mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at United Microelectronics Corporation (Fab 8D) (U08D) site for Die #2 used in the component U2.Estimated First Ship Date: 05 June 2026 (date code: 2623)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Microchip has released a new Datasheet for the BM20-23 Bluetooth Stereo Audio Module Data Sheet of devices. Notification Status: FinalDescription of Change:Physical Dimensions Updated PCB thickness valueImpacts to Data Sheet: See above details.Reason for Change: To improve productivity.Change Implementation Status: CompleteDate Document Changes Effective: 19 Dec 2024
Microchip has released a new Datasheet for the BM20-23 Bluetooth Stereo Audio Module Data Sheet of devices.Description of Change: . Packaging Information - Removed storage information from the sectionReason for Change: To Improve Productivity
Microchip has released a new Datasheet for the BM20-23 Bluetooth Stereo Audio Module Data Sheet of devices.Description of Change:Compliance - Updated this section 9. Certification Notices - Updated this section
Part Status:
On Order
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