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Manufacturer Part #
CY8C4248LQI-BL553T
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1975 per Cut Tape
QFN-56
Surface Mount
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PCN Information:
Subject: Harmonization of marking and label across product portfolios as per Infineon standards.Description:Old:BE Part Rev and FE Fab Code Leadfree Indicator except for BGA packages Existing lot code nomenclature Existing site code Country of Origin (full country name)New: Exclusion of BE Part Rev and FE Fab CodeExclusion of Leadfree Indicator except for BGA packages Standardization to Infineon Lot code Infineon site code Standardization of the Country of OriginNote: For more information refer the SPCN document Reason: To support a uniform product identification and labeling approach across the portfolio, marking and labels are being aligned with Infineon standards. Intended start of delivery 2026-10-30
Description of Change:Extend total storage time to 5 years for SMD and WLx packages.*Old: Maximum storage time is either 2 or 3 years*New: Maximum storage time is 5 yearsReason for Change:Enable longer storage time.Impact Of Change:Technical risk assessment and solderability tests done.No impact seen.Remark: There is change of packing material or bill of material.
Description:Introduction of an additional wafer production site at Hua Hong Grace Semiconductor (HHGrace) Fab3 (200mm) for PSoC 4XX8 BLE 4.2 device.Reason:Expansion of wafer production to assure continuity of supply and enable flexible manufacturing.
Detailed change informationSubject:Label change affecting dedicated Legacy Cypress productsDescription: Old:? Size: 100mm x 63mm New:? Size: 105mm x 51mmReason Change:of label size (with no impact on bar code) to align LegacyCypress with IFX label size.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
