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PIC32CX1012BZ25048-I/MYX
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416 per Std. Mfr. Pkg
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***UPDATEOF PCN111840***Description of Change: Qualification of CuPdAu as a new wire material for PIC32CX1012BZ25048-I/MYX, PIC32CX1012BZ25048-E/MYX, PIC32CX1012BZ25048T-IA0/MYX, PIC32CX1012BZ25048T-E/MYX, PIC32CX1012BZ25048T-IA2/MYX and PIC32CX1012BZ25048T-I/MYX catalog part numbers (CPN) available in 48L VQFN (7x7x0.9mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated First Ship Date: 26 September 2025 (date code: 2539)Revision History:March 26, 2025: Issued initial notification. September 03, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 26, 2025. Included a note about PFAS free material in the Pre and Post Change Table.
Description of Change: Qualification of CuPdAu as a new wire material for PIC32CX1012BZ25048-I/MYX, PIC32CX1012BZ25048-E/MYX, PIC32CX1012BZ25048T-IA0/MYX, PIC32CX1012BZ25048T-E/MYX, PIC32CX1012BZ25048T-IA2/MYX and PIC32CX1012BZ25048T-I/MYX catalog part numbers (CPN) available in 48L VQFN (7x7x0.9mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material. Estimated Qualification Completion Date: June 2025
Microchip has released a new Document for the PIC32CX-BZ2 Family Silicon Errata Sheet of devices.Description of Change:Overview, Silicon ErrataSummary, Silicon ErrataIssuesAdded errata information that are applicable for the WBZ451PE-E deviceData Sheet Clarifications • Added information on Wake-up Timing Specification for Low Power Modes• Updated information on ADC Single-Ended ModeReason for Change: To Improve Productivity.
Description of Change:Document - Added WBZ451PE-E Module (extended temperature variant)- Updated WBZ451 Module Packaging Information- Updated WBZ450 Module Packaging Information- Minor editorial changesIntroduction - Updated section with Pulse Width Modulation (PWM) Outputs informationPackage and Operating Conditions - Added -40°C to +125°C temperature range related to the WBZ451PE-E ModuleCertifications - Added certification information related to the WBZ451PE-E ModulePIC32CX-BZ2 SoC Ordering Information - Updated Table 1-1 with PIC32CX1012BZ25048T-I/MYX and PIC32CX1012BZ25048T-E/MYX ordering details- Updated Figure 1-1 with extended temperature range and tape and reel informationWBZ45 Module Ordering Information - Updated Table 1-2 WBZ451PE-E variant details- Updated Figure 1-2 to Figure 1-3 with temperature and tape and reel informationWBZ45 Module Placement Guidelines - Updated Figure 4-10 and Figure 4-11Pinout Diagram - Updated Figure 3-2 and Figure 3-3Pinout Diagram - Updated Figure 4-3 to Figure 4-5Basic Connection Requirement - Updated Figure 4-6 (changed pin 0 name from EP to 0)- Removed Resistor (R2) in Figure 4-7 and Figure 4-8Reset Requirements - Updated Figure 4-9Pinout and Signal Descriptions List - Added zeroth pin (pin 0) to Table 5-1Reason for Change: To improve productivity.
Microchip has released a new Document for the PIC32CX-BZ2 Family Silicon Errata Sheet of devices.Notification Status: FinalDescription of Change:Overview, Silicon Errata Summary, Silicon Errata IssuesAdded WBZ451H related errata and informationI2CAdded new errataVDD min for A0 device is 2.1VAdded new errataData Sheet ClarificationsAdded new sectionImpacts to Data Sheet: NoneReason for Change: To Improve Productivity Change Implementation Status: CompleteDate Document Changes Effective: 06 Nov 2024
Microchip has released a new Datasheet for the PIC32CX-BZ2 and WBZ45 Family Data Sheet of devices.Notification Status: FinalDescription of Change:Introduction Updated the trademark symbolOperating Conditions Added WBZ451H operating conditionsBluetooth Added WBZ451H “Typical Receiver Power Sensitivity”802.15.4/Zigbee Modulation Scheme • Added WBZ451H “ RX sensitivity”• Added WBZ451H “TX Output Power”• Updated the sensitivity value for RPC modeSystem Peripherals Removed the feature “One Analog Comparator (AC) withWindow Compare function”Core: 64 MHz ARM Cortex-M4 Updated 3.35 Coremark®/MHz to 2.42 Coremark/MHzWBZ45 Module Variants Added WBZ451H moduleAcronyms and Abbreviations Added newWBZ45 Module Ordering Information Added WBZ451H ordering informationConfiguration Summary Added WBZ451H “Configuration Summary”WBZ45 Module Description Added WBZ451H “Module Block Diagram”Pinout Diagram Added WBZ451H “Pinout Diagram”Power Pins Added WBZ451H power pin detailsReset Requirements Added new topic for WBZ451HWBZ451H Module Interface Specifications Added new topic for WBZ451HFigure 4-11 Added the figure for WBZ451HWBZ45 Module RF Considerations Added “RF Specifications” for WBZ451HPinout and Signal Descriptions List Added “Pinout and Signal Descriptions List” for WBZ451HINTFLAG “This flag is set when a new measurement is completed” addedas a noteCTRLC Added a note regarding LIN specification for bits 8 to 9 and 0 to2LUTCTRL Added a note for bit 1: “Prevents/protects write access to theother bits in the LUTCTRL registers”• Event Capture Action• Period and Pulse-Width (PPW) Capture Action• Pulse-Width Capture Action• Timestamp Capture• Waveform Output Generation Operations• Capture OperationsAdded “The user needs to clear INTFLAG.MCx at the beginningof the interrupt routine and poll the bit until INTFLAG.MCx iscleared, before exiting the ISR” as additional sentenceCTRLBCLR Updated register description for bit 0CTRLBCLR Updated register description for bit 0Features • Updated the values for Bluetooth® receiver powersensitivity• Updated the values for Zigbee® RX sensitivity• Added “Programmable Transmit Output Power” forWBZ451H• Added “Typical Receiver Power Sensitivity” for WBZ451HRF Physical Layer Added “Transceiver Architecture” figure for WBZ451HTransmit Mixer and Power Amplifier Added note related to WBZ451HAbsolute Maximum Electrical Characteristics Removed tolerant pinPower Supply Electrical Specifications • Updated the topic title• Updated REG_51 and REG_52 characteristics• Added 2.1 minimum value and added the condition forREG_48AActive Current Consumption DC Electrical Specifications(85°C), Active Current Consumption DC ElectricalSpecifications (125°C), Idle Current Consumption DCElectrical Specifications (85°C), Idle Current ConsumptionDC Electrical Specifications (125°C), Sleep CurrentConsumption DC Electrical Specifications (85°C), SleepCurrent Consumption DC Electrical Specifications(125°C), Deep Sleep Current Consumption DC ElectricalSpecifications (85°C), Deep Sleep Current ConsumptionDC Electrical Specifications (125°C), XDS (Extreme DeepSleep) Current Consumption DC Electrical Specifications(85°C), XDS (Extreme Deep Sleep) Current Consumption DCElectrical Specifications (125°C)Changed the note “Typical value measured duringcharacterization across voltage and temperature” into “Typicalvalue measured at 25°C and 3.3V”I/O PIN AC/DC Electrical Specifications • Updated min and max values• Removed note related to 5V pin• Changed all VDDIO from 3.3 to 3.6VExternal XTAL and Clock AC Electrical Specifications • Removed Typ value for XOSC_2• Removed note related to XOSCCTRL.STARTUPXOSC32 AC Electrical Specifications Removed XOSC32_12 and XOSC32_14TCCx Timer Capture Module AC Electrical Specifications Updated the timing diagramFrequency AC Electrical Specifications Removed min and ma
Description of Change:Silicon Errata Issues AddedReason for Change: To Improve ProductivityData Sheet: https://www.microchip.com/mymicrochip/filehandler.aspx?documentid=b0216ce5-391e-43cd-9b85-fdb2949e8e14
PCN Status:Final NotificationDescription of Change:Qualification of MTAI as an additional assembly site for PIC32CX1012BZ25048-I/MYX, PIC32CX1012BZ25048T-I/MYX, PIC32CX1012BZ25048-E/MYX, PIC32CX1012BZ25048T-E/MYX, PIC32CX1012BZ25048T-IA2/MYX and PIC32CX1012BZ25048T-IA0/MYX catalog part numbers (CPN) available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve productivity by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:July 28, 2024 (date code: 2431)
Description of Change:Qualification of MTAI as an additional assembly site for PIC32CX1012BZ25048-I/MYX, PIC32CX1012BZ25048T-I/MYX, PIC32CX1012BZ25048-E/MYX, PIC32CX1012BZ25048T-E/MYX, PIC32CX1012BZ25048T-IA2/MYX and PIC32CX1012BZ25048T-IA0/MYX catalog part numbers (CPN) available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve productivity by qualifying MTAI as an additional assembly site.
Microchip has released a new Datasheet for the PIC32CX-BZ2 and WBZ45 Family Data Sheet of devices.Description of Change:Bluetooth • Typical receiver power sensitivity values updated • Updated digital RSSI indicator -30 dBm to -50 dBm 02.15.4/Zigbee Modulation Scheme Changed RX sensitivity 103 dBm to 100 dBm System Peripherals Minor changePackage Updated with WBZ450 informationWBZ45 Module Features Updated the sentenceWBZ45 Module Variants Updated with WBZ450 informationPackage and Operating ConditionsCertifications Added one of the notes1.1. PIC32CX-BZ2 SoC Ordering Information Added PIC32CX1012BZ24032 ordering information1.2. WBZ45 Module Ordering Information Added WBZ450 ordering information2. Configuration Summary Updated with WBZ450 information3.2. Pinout Diagram Added PIC32CX1012BZ24032 pinout diagram4.1. Pinout Diagram Added WBZ450 pinout diagram4.2. Basic Connection Requirement Added WBZ450 diagram4.2.4. Unused I/O Pins Removed the note4.6.1. PCB Antenna Added antenna radiation pattern images4.6.2. External Antenna Placement Recommendations Updated the figure5. Pinout and Signal Descriptions List Updated with WBZ450 information9.12.1. CHECON Minor change13.17.9. PBxDIV, 13.17.8. REFOxTRIM, 13.17.7. REFOxCON, 13.17.10. SLEWCON, 13.17.12. CLK_DIAG, 13.17.3. SPLLCON Updated theReset values15.2. Power Modes Minor change15.4. DSCON Added new topic18.4.1. CFGCON0(L) Minor change18.4.2. CFGCON1(L) Added new bits18.4.6. CFGPCLKGEN1 Minor change39.2. Features Added COMP and COMP1 related points42.2. Features Typical receiver power sensitivity values updated42.7. RF Physical Layer Updated transceiver architecture block diagram42.8.1. Transmit Mixer and Power Amplifier Minor change43. Electrical Characteristics Updated all the topics for this chapter44.4. WBZ450 Module Packaging Information Added WBZ450 packaging information45. Appendix A: Regulatory Approval • Updated with WBZ450 information • Added 45.4. Japan, 45.5. Korea, 45.6. Taiwan, ChinaReason for Change: To improve productivity
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