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As the demands for higher-density packaging of electronic equipment increases,the use of flexible printedcircuits (FPC) to reducesize, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook,Palm Top and Note Pad Computers. Other markets include: Disk Drives, Printers, Plotters, Copiers, Cellular Phones, and Medical Equipment.