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Manufacturer Part #
MCP6409-H/SL
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57 per Std. Mfr. Pkg
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Microchip has released a new Datasheet for the MCP6401 0.9uA, Rail-to-Rail Input/Output Op Amps of devices.Notification Status: FinalDescription of Change:1. Updated Section “Features” to specify AECQ100 qualifications.2. Updated 1.2 “MCP6401/1R/1U/2/4 Electrical Specifications” table.3. Updated Section 6.0 “Packaging Information”.4. Added Product Identification System (Automotive) section.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 Mar 2023
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
