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Référence fabricant
MCP9700A-E/TO
MCP9700A Series Low-Power Linear Active Thermistor - TO-92-3
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Bag Style d'emballage :TO-92 Méthode de montage :Through Hole | ||||||||||
| Code de date: | 2506 | ||||||||||
Microchip MCP9700A-E/TO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 116914 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.November 3, 2025: Re-issued final notification to update affected parts list to add MCP9700T H/TTVAO-VW catalog part number. Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 116870 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT-I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Microchip has released a new Datasheet for the MCP9700-Family-Data-Sheet-DS20001942 of devices. Notification Status: FinalDescription of Change:The following is the list of modifications:1. Updated Table DC Electrical Characteristics.2. Updated Section 5.0 “Packaging Information” with Automotive elements.3. Updated the Product Identification System section. Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 10 Mar 2023
Microchip has released a new Datasheet for the Low-Power Linear Active Thermistor ICs of devices.Notification Status: FinalDescription of Change:1. Updated Table DC Electrical Characteristics.2. Updated Section 5.0 “Packaging Information” with Automotive elements.3. Updated the Product Identification System section.Impacts to Data Sheet: See above details.Change Implementation Status: CompleteDate Document Changes Effective: 28 Feb 2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP9700A-E/TO&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--sensors--temperature/mcp9700a-e-to-microchip-2134070
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP9700A-E/TO&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--sensors--temperature/mcp9700a-e-to-microchip-2134070
Microchip MCP9700A-E/TO - Caractéristiques techniques
| Output Type: | Analog |
| Supply Voltage: | 2.3V to 5.5V |
| Operating Temp Range: | -40°C to +125°C |
| Operating Temp Range (°F): | -40°F to +257°F |
| Output Current-Max: | 100µA |
| Style d'emballage : | TO-92 |
| Méthode de montage : | Through Hole |
Fonctionnalités et applications
Microchip Technology is a leading innovator and supplier of high performance and high quality embedded solutions and microcontrollers; related non-volatile memory products; and a broad analog product line focusing on power management, thermal management, linear and mixed-signal solutions.
Temperature sensing is critical to a growing number of consumer, automotive, and industrial applications. Microchip’s Linear Active Thermistor™ Integrated Circuits are sensors whose output voltage is directly proportional to measured temperature.
The MCP9700/9700A and MCP9701/9701A temperature sensor series are suitable for applications that require measurement of a relative change of temperature in the range of -40C to +125C. The temperature coefficient is scaled to provide a 1°C/bit resolution for an 8-bit ADC and their voltage output pin can be directly connected to the ADC input of a microcontroller.
The MCP9700A has accuracy of ±2°C from 0°C to +70°C while consuming 6 µA (typical) of operating current. The output of the MCP9700 is calibrated to a slope of 10mV/°C and has a DC offset of 500mV. The offset allows reading negative temperatures without the need for a negative supply. To accommodate different printed circuit board assembly needs the MCP9700 is offered in both through-hole (TO-92) and surface mount (SOT-23 and SC-70) device type packages.
The MCP9700A-E/TO is a TO-92 Voltage Output Temperature Sensor that comes in a 1000 piece bag.
Emballages disponibles
Qté d'emballage(s) :
1000 par Bag
Style d'emballage :
TO-92
Méthode de montage :
Through Hole