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Référence fabricant
KSZ8721BLI-TR
KSZ8721B Series 2.5 V 10/100 Base TX/FX Physical Layer Transceiver - LQFP-48
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :LQFP-48 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2337 | ||||||||||
Microchip KSZ8721BLI-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of ASEM as an additional assembly site for selected KSZ8001 and KSZ8721 device families available in 48L LQFP (7x7x1.4mm) package.Reason for Change:To improve on-time delivery performance by qualifying ASEM as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:October 11, 2024 (date code: 2441)
Revision History:anuary 25, 2023: Issued initial notification.November 30, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2024Description of Change:Qualification of EN4900G as a new Bottom Die attach material for selected KSZ8001 and KSZ8721 device families available in 48L TQFP (7x7x1.4mm) package.Reason for Change:To improve manufacturability by qualifying EN4900G as a new Bottom Die attach material.
Description of Change:Qualification of EN4900G as a new Bottom Die attach material for selected KSZ8001 and KSZ8721 device families available in 48L TQFP (7x7x1.4mm) package.Reason for Change:To improve manufacturability by qualifying EN4900G as a new Bottom Die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=KSZ8721BLI-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--comm-products--phy/ksz8721bli-tr-microchip-2178564
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=KSZ8721BLI-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--comm-products--phy/ksz8721bli-tr-microchip-2178564
Microchip KSZ8721BLI-TR - Caractéristiques techniques
| Supply Voltage-Nom: | 2.5V to 3.3V |
| No of Functions / Channels: | 1 |
| Interface Type: | PHY |
| Style d'emballage : | LQFP-48 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Features:
- Single chip 10BASE-T, 100BASE-TX, and 100BAS-FX physical layer solution
- Fully compliant to IEEE802.3u standard
- Low-power CMOSn design,power consuption
- Supports media independent interface (MII) and reduced MII(RMII)
- Delivers robust operation
- Furnishes Auto MDI/MDI-X
- Offers both poer-down and power-saving modes
- Configurable thriugh MII serial management ports or via external control pins
- Available in lead-free and industrial temperature versions
Applications:
- LAN on Motherboard
- Media Converter
- Set-Top Box
- Cable/DSL Modem
- Network Printer
- Game Console
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
LQFP-48
Méthode de montage :
Surface Mount