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Manufacturer Part #
IGD06N60TATMA1
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2500 per Reel
TO-252-3 (DPAK)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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PCN Information:
Description:Introduction of an additional FE wafer site production and change of wafer size from 200mm to 300mm for IGBT3_600/650V.Reason:Capacity extension and implementation of a 2nd source.
Subject Introduction of an additional FE wafer site production. Introduction of an additional BE HYME Implementation of an additional mold compound for BE ATX Reason Capacity extension and implementation of a 2nd source Intended start of delivery: 2023-07-30 or earlier on specific customer request
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.