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Référence fabricant
S25FL256LAGMFI003
Serial FLASH 256M SPI 3V 133MHZ 16SOIC
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1450 par Reel Style d'emballage :SOIC-16 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2523 | ||||||||||
Infineon S25FL256LAGMFI003 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Detailed change informationSubject: Data sheet update for S25FL128Lx and S25FL256Lx SOIC productsDescription: Data sheet –Correction of data sheetOld - Rev. MNew - Rev. NReason Correction of package diagram from BGA to SOIC on page 174(only in the English data sheet 002-00124).Intended start of deliveryvalid with immediate effect (documentation update)
Description:Change of wire bond from Cu to CuPdAu for industrial graded SOIC 16L packaged productsReason:Product harmonization of bond wire usage. CuPdAu wire enables superior electrical, thermal and reliability performance, making it an excellent interconnect solution for packaging to ensure business continuity and supply by streamlining its production.LTB - 2025-05-12LTS - 2025-08-12
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=S25FL256LAGMFI003&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--memory--flash--norflash--serial/s25fl256lagmfi003-infineon-1122216
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=S25FL256LAGMFI003&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--memory--flash--norflash--serial/s25fl256lagmfi003-infineon-1122216
Infineon S25FL256LAGMFI003 - Caractéristiques techniques
| Program Memory Type: | Flash |
| Clock Frequency-Max: | 133MHz |
| InterfaceType / Connectivity: | Quad SPI/SPI - Quad I/O |
| Memory Density: | 256Mb |
| Memory Organization: | 32M x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Temperature Grade: | Industrial |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Input Capacitance: | 8pF |
| Moisture Sensitivity Level: | 3 |
| Style d'emballage : | SOIC-16 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1450 par Reel
Style d'emballage :
SOIC-16
Méthode de montage :
Surface Mount