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Manufacturer Part #
PIC18F1320-I/SO
Download the CAD models for this product. Learn more about SnapMagic.
42 per Tube
SOIC-18
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
The PIC18F1320 microcontroller has nanoWatt Technology, which features six enhanced power-managed "software controlled" modes, power consumption as low as 0.1 microamps in standby mode and a wide operating voltage range from 2 to 5.5 volts which makes this device ideal for battery managed applications. This device also encompasses a new low-current watchdog timer, a 2-speed start-up from a reset or sleep mode and a new fail-safe clock monitor that is used to detect an external clock failure.
Features:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.