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MIC69302WU
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50 per Std. Mfr. Pkg
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COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Description of Change:Qualification of KF site as a new BGBM (Backside grinding/metallization) chipbond site for selected HV2815, HV2070, HV2607, HV2707, HV2708, HV2803, HV2818, HV2903, HV2904, HV2915, HV2916, HV2918, HV7322, HV7358, LM2575, LM2576, MIC2171, MIC29150, MIC29151, MIC29152, MIC29201, MIC29202, MIC29203, MIC29204, MIC2920A, MIC29300, MIC29301, MIC29302, MIC29302A, MIC29302H, MIC29303, MIC29310, MIC29312, MIC29371, MIC29372, MIC2937A, MIC2940A, MIC2941A, MIC29500, MIC29501, MIC29502, MIC29503, MIC29510, MIC29512, MIC2954, MIC29712, MIC29751, MIC29752, MIC35302, MIC37100, MIC37102, MIC37150, MIC37151, MIC37152, MIC37252, MIC37300, MIC37301, MIC37302, MIC37501, MIC37502, MIC39100, MIC39101, MIC39150, MIC39151, MIC39152, MIC39300, MIC39301, MIC39302, MIC39500, MIC39501, MIC4574, MIC4575, MIC4576, MIC4685, MIC47150, MIC47300, MIC49150, MIC49200, MIC49300, MIC49500, MIC59300, MIC69301, MIC69302, MIC69502, MIC94050 and MIC94051 device families available in various packages.Reason for Change:To improve manufacturability by qualifying KF site as a new BGBM (Backside grinding/metallization) chipbond site.
*** Update for PCN 111554 ***Revision History: March 19, 2025: Issued initial notification.December 17, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on January 14, 2026. Added column "Change (Yes/No)" in the pre and post change table. Updated part list to add 2A827 and MIC69303RTYME-HP_ASSY and remove MIC69303RTSGC-E, MIC69303RTSGC-MQ, MIC69303RTSGC-SV and MIC69303RTYME HP catalog part numbers (CPN). Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 161-699102, MAQ3203, MIC21xx, MIC22xx, MIC25xx, MIC32xx, MIC422x, MIC44Fxx, MIC682xx, MIC68400, MIC68401, MIC691xx, MIC6930, MIC69502, MIC79110 and MIC920 device families of 2AK (BCD12) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status: In ProgressEstimated First Ship Date: 14 January 2026 (date code: 2603)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 161-699102, MAQ3203, MIC21xx, MIC22xx, MIC25xx, MIC32xx,MIC422x, MIC44Fxx, MIC682xx, MIC68400, MIC68401, MIC691xx, MIC6930, MIC69502, MIC79110 and MIC920 device families of 2AK (BCD12) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:? Corrected the ?Output Voltage (Fixed)? values fields in the Electrical Characteristics table.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
