Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Référence fabricant
5177983-4
Free Height 100 Position Dual Row 0.8 mm Pitch Stacking Board to Board Socket
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | TE Connectivity | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1500 par Tube | ||||||||||
| Code de date: | |||||||||||
TE Connectivity 5177983-4 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Product Description: 0.8mm Free Height ProductsGeneral Description of ChangesThe listed parts have been updated to make a correction of Tin Plating Thickness from 0.002mm to 0.00127mm MIN.Reason for Changes:Update made to correct a documentation error.First Ship Date of Changed Items (Changed Parts Only):07-NOV-2025
Description of Changes: We plan to transfer back existing assembly lines from a TE leased site in Qingdao high tech zone to TE s main campus in Qingdao for Data and Devices business unit. Target transfer schedule to be finished by the end of January 2024.Reason for Changes: To streamline TE's operating efficiencies and align manufacturing resources based on our internal footprint evaluation.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=5177983-4&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/es/p/interconnect--dual-in-line-package-sockets/5177983-4-te-connectivity-6101463
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=5177983-4&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/es/p/interconnect--dual-in-line-package-sockets/5177983-4-te-connectivity-6101463
Emballages disponibles
Qté d'emballage(s) :
1500 par Tube