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Référence fabricant
MIC33153YHJ-TR
MIC3315 Series 4.5 V 4 MHz 1.2 A SMT Internal Inductor Buck Regulator - MLF-14
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC33153YHJ-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for selected MIC1344, MIC23099, MIC2785, MIC28, MIC33xx, MIC38xx, MIC45xx, MX55, MX57, MX85 and MXT57 device families available in various packages.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attachedQualification Plan:Please open the attachments included with this PCN labeled as PCN_#_Qual_Plan.Revision History:November 24, 2023: Issued initial notification.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC33153YHJ-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--regulators-reference--integrated-power-modules/mic33153yhj-tr-microchip-5033101
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC33153YHJ-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--regulators-reference--integrated-power-modules/mic33153yhj-tr-microchip-5033101
Microchip MIC33153YHJ-TR - Caractéristiques techniques
| Input Voltage: | 2.7V to 5.5V |
| Output Voltage: | 1.2V |
| Output Current: | 1.2A |
| Dimensions: | 3 x 3.5 x 1.1 mm |
| Style d'emballage : | MLF-14 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-14
Méthode de montage :
Surface Mount