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Manufacturer Part #
MIC37100-1.8WS-TR
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2500 per Reel
SOT-223 (TO-261-4, SC-73)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description of Change:Qualification of KF site as a new BGBM (Backside grinding/metallization) chipbond site for selected HV2815, HV2070, HV2607, HV2707, HV2708, HV2803, HV2818, HV2903, HV2904, HV2915, HV2916, HV2918, HV7322, HV7358, LM2575, LM2576, MIC2171, MIC29150, MIC29151, MIC29152, MIC29201, MIC29202, MIC29203, MIC29204, MIC2920A, MIC29300, MIC29301, MIC29302, MIC29302A, MIC29302H, MIC29303, MIC29310, MIC29312, MIC29371, MIC29372, MIC2937A, MIC2940A, MIC2941A, MIC29500, MIC29501, MIC29502, MIC29503, MIC29510, MIC29512, MIC2954, MIC29712, MIC29751, MIC29752, MIC35302, MIC37100, MIC37102, MIC37150, MIC37151, MIC37152, MIC37252, MIC37300, MIC37301, MIC37302, MIC37501, MIC37502, MIC39100, MIC39101, MIC39150, MIC39151, MIC39152, MIC39300, MIC39301, MIC39302, MIC39500, MIC39501, MIC4574, MIC4575, MIC4576, MIC4685, MIC47150, MIC47300, MIC49150, MIC49200, MIC49300, MIC49500, MIC59300, MIC69301, MIC69302, MIC69502, MIC94050 and MIC94051 device families available in various packages.Reason for Change:To improve manufacturability by qualifying KF site as a new BGBM (Backside grinding/metallization) chipbond site.
Product Category: Linear RegulatorsNotification Subject: CCB 7745 Initial Notice: Implement new carrier tape design for selected MIC2920A, MIC39100, MIC2954 and MIC37100 device families available in 3L SOT-223Description of Change: Implement new carrier tape design for selected MIC2920A, MIC39100, MIC2954 and MIC37100 device families available in 3L SOT-223Reason for Change: To improve manufacturability by implementing new carrier tape design.Estimated Qualification Completion Date: March 2026
Description of Change: Qualification of HANA as an additional assembly site for selected MIC2920A, MIC2954, MIC37100 and MIC39100 device families available in 3L SOT-223 package.Reason for Change: To improve on-time delivery performance by qualifying HANA as an additional assembly site.
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
***UPDATE OF PCN114123***Revision History: June 25, 2025: Issued initial notificationJuly 08, 2025: Re-issued initial notification to update the carrier tape information in the pre and post change summary.Description of Change: Qualification of HANA as an additional final test location for selected MIC2954, MIC2920A, MIC37100, MIC39100, MIC5201, MIC5200, MIC5233, MIC5239, MIC5209 and MIC79050 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying HANA as an additional final test location.
Description of Change: Qualification of HANA as an additional final test location for selected MIC2954, MIC2920A, MIC37100, MIC39100, MIC5201, MIC5200, MIC5233, MIC5239, MIC5209 and MIC79050 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying HANA as an additional final test location.
Description of Change: Qualification of MTAI as an additional final test location for selected MIC5233, MIC2920A, MIC2954, MIC5200, MIC5201, MIC5209, MIC79050, MIC39100, MIC37100, and MIC5239 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: September 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
The MIC37100-1.8WS TR is a 1 A low-dropout, linear voltage regulator that provide low-voltage, high-current output from an extremely small package. Utilizing Micrel’s proprietary Super βeta PNP™ pass element, the MIC37100/01/02 offers extremely low dropout (typically 280 mV at 1 A) and low ground current (typically 11 mA at 1 A).
The MIC37100 is a fixed output regulator offered in the SOT-223 package. The MIC37100/01/02 is ideal for PC add-in cards that need to convert from standard 5 V to 3.3 V, 3.3 V to 2.5 V or 2.5 V to 1.8 V or lower. A guaranteed maximum dropout voltage of 500 mV over all operating conditions allows the MIC37100/01/02 to provide 2.5 V from a supply as low as 3 V and 1.8 V from a supply as low as 2.3 V.
The MIC37100-1.8WS TR is fully protected with over current limiting and thermal shutdown. Fixed output voltages of 1.5 V, 1.65 V, 1.8 V, 2.5 V and 3.3 V are available on MIC37100/01 with adjustable output voltages to 1.24 V on MIC37102.
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