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ATSAMC21E17A-MNT
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5000 per Std. Mfr. Pkg
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COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Description of Change:Qualification of Panel Level Package (PLP) packaging process technology for selected ATSAMC20E15A, ATSAMC20E16A, ATSAMC20E17A, ATSAMC20E18A, ATSAMC21E15A, ATSAMC21E16A, ATSAMC21E17A, ATSAMC21E18A, PIC32CM3204JH00032 and PIC32CM6408JH00032 device families available in 32L VQFN (5x5x1mm) and 32L VQFN-WFS (5x5x1mm) packages at MP3A assembly site.Reason for Change: To improve productivity, manufacturability and cycle time by qualifying panel level package (PLP) packaging technology at MP3A assembly site.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire for selected ATSAMC20E1, ATSAMC20G1, ATSAMC21E1, ATSAMC21G1, ATSAMD20E1, ATSAMD20G1, ATSAMD21E1, ATSAMD21G1, ATSAML10E1, ATSAML11E1, ATSAML21E1, ATSAML21G1, ATSAML22G1, PD39210, PD69210, PD77010, PD77020, PIC32CM1216MC00048, and PIC32CM6408MC00048 device families available various packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status: In ProgressEstimated First Ship Date: 04 March 2026 (date code: 2610)
*** Update for PCN 115821 ***Revision History: September 10, 2025: Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 31, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMD20E14, ATSAMC20E15A, ATSAMC20E16A, ATSAMC20E17A, ATSAMC20E18A, ATSAMC21E15A, ATSAMC21E16A, ATSAMC21E17A, ATSAMC21E18A, ATSAMD20E15, ATSAMD20E16, ATSAMD20E17, ATSAMD20E18, ATSAMD21E15, ATSAMD21E15L, ATSAMD21E16, ATSAMD21E16L, ATSAMD21E17, ATSAMD21E17L, ATSAMD21E18, ATSAML10E14A, ATSAML10E15A, ATSAML10E16A, ATSAML11E14A, ATSAML11E15A and ATSAML11E16A device families available in 32L VQFN (5x5x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 31 October 2025 (date code: 2544)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMD20E14, ATSAMC20E15A, ATSAMC20E16A, ATSAMC20E17A, ATSAMC20E18A, ATSAMC21E15A, ATSAMC21E16A, ATSAMC21E17A, ATSAMC21E18A, ATSAMD20E15, ATSAMD20E16, ATSAMD20E17, ATSAMD20E18, ATSAMD21E15, ATSAMD21E15L, ATSAMD21E16, ATSAMD21E16L, ATSAMD21E17, ATSAMD21E17L, ATSAMD21E18, ATSAML10E14A, ATSAML10E15A, ATSAML10E16A, ATSAML11E14A, ATSAML11E15A and ATSAML11E16A device families available in 32L VQFN (5x5x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
****FPCN115312/FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMD21xx, ATSAMC21xx, ATSAMC20xx, ATSAMDA1xx, ATSAMD20xx, ATSAML22xx, ATSAML21xx, PIC32CM2xx, PIC32CM1xx, PIC32CM3xx, PIC32CM6xx, ATSAML10xx,ATSAML11xx and PIC32CM5xx device families available in 32L and 48L VQFN (5x5x1mm and 7x7x0.9mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Document for the SAM C20/C21 Family Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change:The following Silicon Issues were added in this revision:? ADC: 1.4.10 Syncbusy Enable? Device: 1.8.15 One-Time Programmable LockThroughout the document, updates were performed to add Silicon Revision H.Impacts to Data Sheet: NoneChange Implementation Status: CompleteEstimated First Ship Date: 07 July 2025
Description of Change:Rev. R Document- Updated the verbiage for Device errata 1.8.15 One Time Programmable Lock to read Program and Debug Interface Disable.Reason for Change:To improve productivity.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
