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Manufacturer Part #
PI5A3157CEX
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3000 per Reel
SOT-363 (SC-70-6, SC-88)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Change Type: Additional Fab/AT Sites, BOMTITLE: Additional Fab Sources SPFAB, KF4, MXIC, TYNTEK, and AT Sites PCL, CAT, SAT, TD, and Assembly BOM DESCRIPTION OF CHANGEThis PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified additional manufacturing sites and Bill of Material (BOM) changes:? Diodes internal wafer source in South Portland (SPFAB), Maine, USA.? External wafer source Key Foundry Fab 4 (KF4) in Cheongju, South Korea.? External wafer source Macronix International Co., Ltd. (MXIC), in Hsinchu, Taiwan. ? Diodes internal AT site (PCL) in Taoyuan City, Taiwan.The hermetic sealing process for the lid will change from a AuSn process in Faith Long AT to a Kovar process in PCL as described in Table 3A. A comparison between the current die source TASC (Die ED-009IRC) and new die source TYNTEK (Die TK0A09IRG) is provided in Table 7A.? Diodes internal A/T Site (CAT) in Chengdu, China.? Diodes internal AT Site (SAT) in Shanghai, China.? External AT site Fujian Tiandian Optoelectronic Co., Ltd. (TD) located in Fujian, China, including additional BOM and additional die source from Tyntek Corporation (TYNTEK) located in Chunan, Taiwan. Implementation Date: Apr 28, 2026
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.