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Référence fabricant
MIC28517T-E/PHA
75V Multi-die Buck Switcher with MXP FETs
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :VQFN-32 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2503 | ||||||||||
Microchip MIC28517T-E/PHA - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: This qualification was originally performed to qualify ATP7 as an additional assembly site for selected MIC28514, MIC28515, MIC28516, and MIC28517 device families available in 32L VQFN (6x6x0.9mm) packageReason for Change: Microchip has decided to not qualify ATP7 as an additional assembly site for selected MIC28514, MIC28515, MIC28516, and MIC28517 device families available in 32L VQFN (6x6x0.9mm) package.Revision History: May 24, 2024: Issued initial notification. January 17, 2025: Issued cancellation notification.
PCN Status:Final NotificationDescription of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as new fabrication site for Die#2 and Die#3 for selected MIC2851xx device families in 32L VQFN (6x6x0.9mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying TMGR as new fabrication site for Die#2 and Die#3.Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2023 (date code: 2313)
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of Microchip Technology Tempe ? Fab 2 (TMGR) as a new fabrication site for Die#2, Die#3 and EME-G700LA as a new mold compound material for selected MIC2851xx device families available in 32L VQFN (6x6x0.9mm) package at ASE assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying Microchip Technology Tempe ? Fab 2 (TMGR) as a new fabrication site for Die#2, Die#3 and EME-G700LA as a new mold compound material.Change Implementation Status:In ProgressEstimated First Ship Date:September 30, 2022 (date code: 2240)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Statut du produit:
Microchip MIC28517T-E/PHA - Caractéristiques techniques
| Style d'emballage : | VQFN-32 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
VQFN-32
Méthode de montage :
Surface Mount
