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Référence fabricant
MCP1826T-ADJE/DC
1A CMOS LDO, ADJUSTABLE VOUT, EXTENDED TEMP RANGE
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :4000 par Reel Style d'emballage :SOT-223-5 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP1826T-ADJE/DC - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 112912 ***Revision History: March 07, 2025: Issued initial notification.March 10, 2025: Re-issued initial notification to update the Qualification Plan file.May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.November 11, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 10, 2025. Updated affected parts list to add MCP1824ST1202E/DBVAO, MCP1824T1802E/OTVAO, MCP1825S-5002E/DBVAO and MCP1725-5002E/SNVAO catalog part numbers (CPN). Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families of 132k and 133k technologies available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 10 December 2025 (date code: 2550)
******FPCN111387 UPDATE/LOCATION CHANGE******Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.**March 10, 2025: Re-issued initial notification to update the Qualification Plan file.**May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1826T-ADJE/DC&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1826t-adje-dc-microchip-9407784
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1826T-ADJE/DC&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1826t-adje-dc-microchip-9407784
Microchip MCP1826T-ADJE/DC - Caractéristiques techniques
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 6V |
| Output Voltage Range: | 0.8V to 5V |
| Output Voltage Fixed: | 0.8V |
| Dropout Voltage-Max: | 400mV |
| Output Current-Max: | 1A |
| Rated Power: | 2.01W |
| Tolerance (%): | ±2% |
| Operating Temp Range: | -40°C to +125°C |
| Regulator Topology: | Adjustable |
| Quiescent Current: | 220µA |
| No. of Outputs: | Single |
| Output Noise: | 2µV |
| Load Regulation (%): | 1% |
| Line Regulation (%): | 0.2% |
| Style d'emballage : | SOT-223-5 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP1826 series of 1 A, ceramic output cap stable, low output voltage, Low Dropout Regulator (LDO). It is part of the family of LDOs that includes 500 mA MCP1825S and 1.5 A MCP1827S.
The 1000 mA output current capability, combined with the low output voltage capability, make the MCP1826 a good choice for new sub-1.8 V output voltage LDO applications that have high current demands. The MCP1826S is a 3-pin fixed voltage version. The MCP1826S comes in thermally enhanced DDPAK-3 and TO-220-3 packages as well as space-efficient SOT223-3 package.
Features:
- Up to 1 A output load current
- Low dropout voltage 300 mV (typ)
- Output voltage from 0.8 V to 5.0 V
- Stable with 1.0 µF ceramic output cap
- Low supply current 120 µA typical
- DDPAK-3, TO-220-3, SOT223-3 Pb-free packages
Applications:
- High-Speed Driver Chipset Power
- Networking Backplane Cards
- Notebook Computers
- Network Interface Cards
- Palmtop Computers
- 2.5 V to 1.X V Regulators
View the complete product family of MCP1826 series Linear regulator
Emballages disponibles
Qté d'emballage(s) :
4000 par Reel
Style d'emballage :
SOT-223-5
Méthode de montage :
Surface Mount
