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Manufacturer Part #
MIC2937A-12WU-TR
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750 per Reel
TO-263-3 (D2PAK)
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description of Change:Qualification of KF site as a new BGBM (Backside grinding/metallization) chipbond site for selected HV2815, HV2070, HV2607, HV2707, HV2708, HV2803, HV2818, HV2903, HV2904, HV2915, HV2916, HV2918, HV7322, HV7358, LM2575, LM2576, MIC2171, MIC29150, MIC29151, MIC29152, MIC29201, MIC29202, MIC29203, MIC29204, MIC2920A, MIC29300, MIC29301, MIC29302, MIC29302A, MIC29302H, MIC29303, MIC29310, MIC29312, MIC29371, MIC29372, MIC2937A, MIC2940A, MIC2941A, MIC29500, MIC29501, MIC29502, MIC29503, MIC29510, MIC29512, MIC2954, MIC29712, MIC29751, MIC29752, MIC35302, MIC37100, MIC37102, MIC37150, MIC37151, MIC37152, MIC37252, MIC37300, MIC37301, MIC37302, MIC37501, MIC37502, MIC39100, MIC39101, MIC39150, MIC39151, MIC39152, MIC39300, MIC39301, MIC39302, MIC39500, MIC39501, MIC4574, MIC4575, MIC4576, MIC4685, MIC47150, MIC47300, MIC49150, MIC49200, MIC49300, MIC49500, MIC59300, MIC69301, MIC69302, MIC69502, MIC94050 and MIC94051 device families available in various packages.Reason for Change:To improve manufacturability by qualifying KF site as a new BGBM (Backside grinding/metallization) chipbond site.
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: September 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
