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Manufacturer Part #
MIC5233-3.3YS
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78 per Tube
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*****FPCN 111176 UPDATE/LOCATION CHANGE*****Revision History:February 27, 2025: Issued initial notification.February 20, 2026: Issued final notification. Attached the Qualification Report. Provided the Estimated First Ship date to be on March 30, 2026. Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change:Qualification of HANA as an additional assembly site for selected MIC5233, MIC5239, MIC5209, MIC79050 and MIC5201 device families available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.*Please see documents for additional changes
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5233, MIC5295, MIC5225, MIC5235 and MIC3490 device families of 21K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 12 December 2025 (date code: 2550)
***UPDATE OF PCN111394***Description of Change: Qualification of MTAI as an additional final test location for selected MIC5233, MIC2920A, MIC2954, MIC5200, MIC5201, MIC5209, MIC79050, MIC39100, MIC37100, and MIC5239 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location.Revision History:March 10, 2025: Issued initial notification.June 17, 2025: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on July 14, 2025. Updated affected CPN list to remove all Tape and Reel parts based on the updated scope. Updated the Pre and Post Change Summary Table and attached file.
Description of Change: Qualification of MTAI as an additional final test location for selected MIC5233, MIC2920A, MIC2954, MIC5200, MIC5201, MIC5209, MIC79050, MIC39100, MIC37100, and MIC5239 device families available in 3L SOT-223 package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test location.
Description of Change: Qualification of HANA as an additional assembly site for selected MIC5233, MIC5239, MIC5209, MIC79050 and MIC5201 device families available in 3L SOT-223 package.Reason for Change: To improve on-time delivery performance by qualifying HANA as an additional assembly site.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5207, MIC5209, MM5450, MM5451, MIC38C44, MIC38C45, MIC38C42, MIC38C43, MIC5233, MIC5205, MIC5235, MIC5219, MIC5225, MIC4684, MIC5239, MIC5236, MIC5234,MIC5238, MIC5210, MIC79050, MIC5212, MIC5201, MIC3490, MIC4685, MIC5295, MIC4680, and MIC5237 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Microchip has released a new Datasheet for the MIC5233 Data Sheet of devices. Notification Status: FinalDescription of Change:? Minor layout changes.? Updated Section 5.0, Packaging Information.? Added automotive information and examples to Product Identification System.? Corrected Revision History error: Revision C did not change anything in the Features and Product Identification System sections.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 March 2023
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