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Référence fabricant
SST39VF3201-70-4I-B3KE
SST39VF Series 32 Mbit 2 M x 16 3 V Multi-Purpose Flash Plus - TFBGA-48
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :480 par Tray Style d'emballage :TFBGA-48 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2332 | ||||||||||
Microchip SST39VF3201-70-4I-B3KE - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***July 26, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 23, 2024***Description of Change:Qualification of ATP7 as an additional assembly site for selected SST38VF640x, SST39LF40x, SST39LF80xx, SST39VF16xx, SST39VF32xx, SST39VF40xx, SST39VF80xx, SST39WF160x, SST39WF800B and SST39WF400B device families available in 48L TFBGA (6x8x1.2mm) package.Reason for Change:To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.
Description of Change:Qualification of ATP7 as an additional assembly site for selected SST38VF640x, SST39LF40x, SST39LF80xx, SST39VF16xx, SST39VF32xx, SST39VF40xx, SST39VF80xx, SST39WF160x, SST39WF800B and SST39WF400B device families available in 48L TFBGA (6x8x1.2mm) package.Reason for Change:To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST39VF3201-70-4I-B3KE&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--flash--norflash--nor/sst39vf3201-70-4i-b3ke-microchip-8737371
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST39VF3201-70-4I-B3KE&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--flash--norflash--nor/sst39vf3201-70-4i-b3ke-microchip-8737371
Microchip SST39VF3201-70-4I-B3KE - Caractéristiques techniques
| Memory Density: | 32Mb |
| Memory Organization: | 2 M x 16 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Access Time-Max: | 70ns |
| Style d'emballage : | TFBGA-48 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.
The SST39VF3201-70-4I-B3KE is a part of SST39VF Series Multi-Purpose Flash Plus. It has an standard operating temperature ranging from -40°C to +85°C, it comes in TFBGA-48 package.
The SST39VF3201 device is organized in 2M x16, The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.
Features:
- Organized as 2M x16: SST39VF3201
- Low Power Consumption (typical values at 5 MHz)
- Active Current: 9 mA (typical)
- Standby Current: 3 µA (typical)
- Auto Low Power Mode: 3 µA (typical)
- Hardware Block-Protection/WP# Input Pin
- Top Block-Protection (top 32 KWord) for SST39VF3202
- Bottom Block-Protection (bottom 32 KWord) for SST39VF3201
- Sector-Erase Capability
- Uniform 2 KWord sectors
- Block-Erase Capability
- Uniform 32 KWord blocks
- Chip-Erase Capability
- Erase-Suspend/Erase-Resume Capabilities
- Hardware Reset Pin (RST#)
- Security-ID Feature
- SST: 128 bits; User: 128 bits
- Fast Erase and Word-Program:
- Sector-Erase Time: 18 ms (typical)
- Block-Erase Time: 18 ms (typical)
- Chip-Erase Time: 40 ms (typical)
- Word-Program Time: 7 µs (typical)
- Packages Available
- 48-lead TSOP (12mm x 20mm)
- 48-ball TFBGA (6mm x 8mm)
- All non-Pb (lead-free) devices are RoHS compliant
View the complete SST39VF Series of Multi-Purpose Flash
Emballages disponibles
Qté d'emballage(s) :
480 par Tray
Style d'emballage :
TFBGA-48
Méthode de montage :
Surface Mount