Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
PIC16F18313-I/SN
Download the CAD models for this product. Learn more about SnapMagic.
100 per Tube
SOIC-8
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
*** Update of FPCN 99831 ***Revision History: Issued final notification. 3/10/2026 - Corrected the initial issuance from year 2022 to 2023. Updated the die attach in Post change table from "8390A to QMI519". Updated the Dap Surface Prep in Post change table to add "Selective Ag Plating". Revised the notification subject to reflect the updated affected parts list. Updated the affected parts list to include AVR16DD14-I/SL, AVR32DD14E/SL, AVR32DD14-I/SL, AVR16DD14-E/SL, AVR16DD14T-E/SL, AVR32DD14TI/SL, AVR32DD14T-E/SL, AVR16DD14T-I/SL, PIC18F06Q20-E/SL, PIC18F06Q20TI/SL, PIC18F06Q20-I/SL, AVR16DU14-I/SL, AVR16DU14T-I/SL, AVR32DU14TI/SL, AVR32DU14-I/SL, PIC18F04Q20-E/SL, PIC18F05Q20-I/SL, PIC18F04Q20I/SL, PIC18F05Q20-E/SL, PIC18F05Q20T-I/SL, PIC18F04Q20T-I/SL, PIC16F15323TE/SL, PIC16F15313T-I/SN020 catalog part numbers and to remove the EOL'd CPN PIC16F15313TI/SN021. Added the "Change (Yes/No) column to the Pre- and Post- Change Summary table. Attached the Qualification Report. Provided the estimated first ship date to be on April 03, 2026.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected product device families listed on the SPCN attachment are available in 14L and 8L SOIC (3.90mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated First Ship Date: 03 April 2026 (date code: 2614)
PCN Status: Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF153xx, PIC16LF183xx, PIC16LF184xx, PIC18F04Q4xx, PIC18F05Q4xx and PIC18F06Q4xx device families available in 14L and 8L SOIC (3.90mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
