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Manufacturer Part #
ATMEGA329P-20MUR
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4000 per Std. Mfr. Pkg
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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PCN Information:
Microchip has released a new Errata for the ATmega329P/ATmega3290P SEDSC of devices.Description of Change: Initial document release.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700LA as a new mold compound material for selected ATMEGA64xx, ATMGA16xx, ATMEGA25xx and ATMEGA32xx device families available in 64L VQFN (9x9x1.0 mm) package.Reason for Change:To improve manufacturability by qualifying G700LA as new mold compound material.Change Implementation Status:In ProgressEstimated First Ship Date:December 23, 2022 (date code: 2252)
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.