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Manufacturer Part #
ATMEGA88PB-AN
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250 per Std. Mfr. Pkg
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
PCN Status:Initial NotificationDescription of Change:Qualification of MTAI as an additional final test location for ATMEGA168PBxx, ATMEGA48PBxx, and ATMEGA88PBxx device family available in 32L TQFP (7x7x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional test location.
Revision History:December 23, 2019: Issued initial notification.February 14, 2020: Issued final notification. Attached the Qualification Report. Updated the pre and post change to add CEL-9240 molding compound material. Provided estimated first ship date to be on March 14, 2020.April 11, 2023: Re-issued final notification. Updated affected parts list to include ATMEGA328PB-ABTVAO catalog part number (CPN).Description of Change: Qualification of MTAI as a new assembly site for selected Atmel products available in 32L (7x7x1.0mm) and 48L TQFP (7x7x1.0mm) package using gold (Au) wire.Pre Change:Assembled at ASCL assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, G700 and CEL-9240 molding compound, EN4900G die attach, and C194-ESH lead frame material with MSL Level 3 classification.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
