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Référence fabricant
B3P-VH-FB-B(LF)(SN)
VH Series 3 Position 3.96 mm Pitch Through Hole Vertical Shrouded Header
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| Nom du fabricant: | JST | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :200 par Box Méthode de montage :Through Hole | ||||||||||
| Code de date: | 2422 | ||||||||||
JST B3P-VH-FB-B(LF)(SN) - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=B3P-VH-FB-B(LF)(SN)&field4=JST&field18=https://p1na.futureelectronics.com/fr/it/p/interconnect--pin-and-socket-connectors--header-plug-wire-mount/b3p-vh-fb-b-lf-sn-jst-4000952
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=B3P-VH-FB-B(LF)(SN)&field4=JST&field18=https://p1na.futureelectronics.com/fr/it/p/interconnect--pin-and-socket-connectors--header-plug-wire-mount/b3p-vh-fb-b-lf-sn-jst-4000952
JST B3P-VH-FB-B(LF)(SN) - Caractéristiques techniques
| Type: | Shrouded Header |
| Style/Orientation: | Vertical Header/Plug |
| No of Positions: | 3 |
| Pitch: | 3.96 mm |
| Termination: | Through Hole |
| Méthode de montage : | Through Hole |
Fonctionnalités et applications
The B3P-VH-FB-B(LF)(SN) is a 3 position, 3.96 mm pitch and through hole vertical shrouded header.
This small, field-proven cinnector for printed circuit boards is reliable and has a large current carrying capacity. It can be used with a wide variety of signal, power supply and output circuits that appear in consumer electronic products.
Features:
- Current rating: 10A AC, DC(AWG #16)
- Voltage rating: 250V AC, DC
- Temperature rating: -25°C to +85°C
- Contact resistance: Initial value/10mO max
- Insulation resistance: 1000M O min
- Withstanding voltage: 1500V AC/minute
- Applicable wire: AWG #22 to #16
- Applicable PC board thickness: 1.6 mm
View the available B3P-VH series of vertical shrouded header
Emballages disponibles
Qté d'emballage(s) :
200 par Box
Méthode de montage :
Through Hole