Manufacturer Part #
MCP4023T-103E/CH
MCP4023 Series 64 Step 2-Wire 10 kOhm Non-Volatile Digital POT - SOT-23-6
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2534 | ||||||||||
Microchip MCP4023T-103E/CH - Product Specification
Shipping Information:
ECCN:
PCN Information:
CCB 7276 Final NoticeDescription of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 07 March 2025 (date code: 2510)Revision History: November 13, 2024: Issued initial notification.January 31, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on March 07, 2025.
Description of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status:In ProgressEstimated First Ship Date:February 16, 2023 (date code: 2307)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=Asia&field16=en&field2=MCP4023T-103E/CH&field4=Microchip&field18=https://p1apac.futureelectronics.com/it/p/semiconductors--analog--digital-potentiometers/mcp4023t-103e-ch-microchip-4187175
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=Asia&field16=en&field2=MCP4023T-103E/CH&field4=Microchip&field18=https://p1apac.futureelectronics.com/it/p/semiconductors--analog--digital-potentiometers/mcp4023t-103e-ch-microchip-4187175
Microchip MCP4023T-103E/CH - Technical Attributes
| No of Positions: | 64 |
| No of Channels: | 1 |
| Interface: | 2-Wire |
| Wiper Storage: | Non-Volatile |
| Resistance: | 10kΩ |
| Tolerance: | ±20% |
| Supply Voltage: | 2.7V to 5.5V |
| Supply Current: | 1µA |
| Operating Temp Range: | -40°C to +125°C |
| Wiper Resistance: | 325Ω |
| Temp Coefficient (ppm/C): | 150ppm/°C |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount