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Référence fabricant
SST26VF064BT-104I/SM
SST26VF064B Series 64 Mb (8M x 8) 3.6V Serial Quad I/O (SQI) Flash Memory-SOIJ-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :2100 par Reel Style d'emballage :SOIJ-8 Méthode de montage :Surface Mount |
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| Code de date: | 2439 | ||||||||||
Microchip SST26VF064BT-104I/SM - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update of FPCN 119261 ***Revision History:February 23, 2026: Issued initial notification.February 26, 2026: Re-issued initial notification to include SOIJ package in the Notification subject.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC and SOIJ (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: April 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach materialEstimated Qualification Completion Date: April 2026
Data Sheet - SST26VF064B / SST26VF064BA, 3.0V 64 Mbit Serial Quad I/O (SQI) Flash Memory Data Sheet Document Revision Description of Change: 1) Revised "Product Description" on page 1. 2) Added footnote to Table 7-4 on page 47. 3) Added information for "MN" package 8-WDFN. 4) Added Part Markings. 5) Updated Package definitions for "Product Identification System" on page 65. NOTE: Please be advised that this is a change to the document only the product has not been changed
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST26VF064BT-104I/SM&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--memory--RAM--nvram--quantum-trap-nvsram/sst26vf064bt-104i-sm-microchip-3067047
Microchip SST26VF064BT-104I/SM - Caractéristiques techniques
| Style d'emballage : | SOIJ-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2100 par Reel
Style d'emballage :
SOIJ-8
Méthode de montage :
Surface Mount