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Manufacturer Part #
ATMEGA1280-16AU
Download the CAD models for this product. Learn more about SnapMagic.
90 per Tray
TQFP-100
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for AT90CAN128-16AU, AT90CAN128-16AUR, AT90USB1286-AU, AT90USB1286-AUR, AT90USB1287-AU, AT90USB1287-AUR, AT90USB646-AU, AT90USB646-AUR, AT90USB647-AU, AT90USB647-AUR, ATMEGA1280-16AU, ATMEGA1280-16AU-HCM, ATMEGA1280-16AUR, ATMEGA1280V-8AU, ATMEGA1280V-8AUR, ATMEGA1281-16AU, ATMEGA1281-16AUR, ATMEGA1281V-8AU, ATMEGA1281V-8AUR, ATMEGA2560-16AU, ATMEGA2560-16AU-HCM, ATMEGA2560-16AUR, ATMEGA2560V-8AU, ATMEGA2560V-8AUR, ATMEGA2561-16AU, ATMEGA2561-16AUR, ATMEGA2561V-8AU, ATMEGA2561V-8AUR, ATMEGA640-16AU, ATMEGA640-16AUR, ATMEGA640-16AURA0, ATMEGA640V-8AU and ATMEGA640V-8AUR catalog part numbers (CPN) available in 64L and 100L TQFP (14x14x1mm) package assembled at MMT site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material.Estimated First Ship Date: 26 May 2026 (date code: 2622)*Final Notification
Product Category: 8-Bit MicrocontrollersDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT90CAN128, AT90USB1286, AT90USB1287, AT90USB646, AT90USB647, ATmega1280, ATmega1281, ATmega2560, ATmega2561 and ATmega640 device families available in 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MMT assembly site.Estimated Qualification Completion Date: April 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
***June 12, 2024: Issued cancellation notification***Description of Change:This qualification was originally performed to qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.Reason for Change:Microchip has decided to not qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
