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Manufacturer Part #
MCP2140T-I/SS
MCP2140 Series 9600 Baud Stacked Controller Surface Mount - SSOP-20
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1600 per Reel Package Style:SSOP-20 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP2140T-I/SS - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
Microchip MCP2140T-I/SS - Technical Attributes
| Operating Voltage: | 4.25V |
| Rise Time / Fall Time: | 25ns |
| Package Style: | SSOP-20 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1600 per Reel
Package Style:
SSOP-20
Mounting Method:
Surface Mount