Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Référence fabricant
CYPD3135-40LQXQ
CCG3 Series 128 KB Flash 8 KB SRAM 21.5V 1Mb/s USB Type-C Port Controller-QFN-40
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :490 par Tray Style d'emballage :QFN-40 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2431 | ||||||||||
Infineon CYPD3135-40LQXQ - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 109266 /Molding Compound Change ***- Original PCN N? 2024-164-A dated 2024-11-07- Delta to previous revision:- Update of First sample availability data from 2025-02-28 to 2026-03-31.- Update of the Intended start of delivery from 2025-04-15 to 2026-06-30.Subject Change of mold compound from Kyocera KEG3000NASLS, KEG3000DACY to Sumitomo EME G600CE for products from Infineon Technologies Manufacturing Ltd. Philippines Branch.Reason Experienced inconsistency delivery support from existing mold compound supplier - Kyocera. To enable sourcing flexibility and mitigate supply risk, Sumitomo is introduced as an additional mold compound supplier.DescriptionOld:- Kyocera KEG3000NASLS/KEG3000DACYNew- Sumitomo EME G600CE- Kyocera KEG3000NASLS/KEG3000DACY- Time schedule- Final qualification report Available- First samples available 2026-03-31- Intended start of delivery 2026-06-30
Description:Extension of total storage time of Finished Goods to 5 years for SMD (Surface Mount Devices) and WLCSP (Wafer Level Chip-Scale Package) packagesReason Infineon able to improve our Finished Goods storage from 2 years to 5 years without having any impact to quality and performance.Intended start of delivery - 2025-09-30
Description:Change of mold compound from Kyocera KEG3000NASLS, KEG3000DACY to Sumitomo EME G600CE for products fromInfineon Technologies Manufacturing Ltd. Philippines BranchReason:Experienced inconsistency delivery support from existing mold compound supplier - Kyocera. To enable sourcing flexibility and mitigate supply risk, Sumitomo is introduced as an additional mold compound supplier.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=CYPD3135-40LQXQ&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--signal-interface--usb/cypd3135-40lqxq-infineon-3084124
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=CYPD3135-40LQXQ&field4=Infineon&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--signal-interface--usb/cypd3135-40lqxq-infineon-3084124
Infineon CYPD3135-40LQXQ - Caractéristiques techniques
| Supply Voltage: | 2.7V to 21.5V |
| Operating Temp Range: | -40°C to +105°C |
| Interface/Version: | 3.0 |
| Interface Type: | SPI/UART/I2C/USB |
| No of Pins: | 40 |
| Supply Current: | 25mA |
| Protocols Supported: | USB |
| Frequency: | 48MHz |
| No of Ports: | Single |
| Moisture Sensitivity Level: | 3 |
| Style d'emballage : | QFN-40 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
490 par Tray
Style d'emballage :
QFN-40
Méthode de montage :
Surface Mount