Manufacturer Part #
SY89858UMG
SY89858U Series 2.5/3.3 V 3 GHz Low Power 1:8 LVPECL Fanout Buffer - MLF-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:60 per Tube Package Style:MLF-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip SY89858UMG - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
Microchip SY89858UMG - Technical Attributes
| Type: | Differential |
| Clock Output Frequency - Max: | 3GHz |
| Supply Voltage-Nom: | 2.5V to 3.3V |
| Package Style: | MLF-32 |
| Mounting Method: | Surface Mount |
Features & Applications
The SY89858UMG is a precision low-power, high-speed and fully differential 1:8 LVPECL Fanout Buffer. Available in surface mount MLF-32 package.
Features:
- Three low-skew LVPECL output banks with programmable ÷1, ÷2 and ÷4 divider options
- Three independently programmable output banks
- Guaranteed AC performance over temp and voltage:
- >1.5GHz clock frequency (fMAX)
- <930ps In-to-Out tpd
- <220ps tr/tf
- Ultra-low jitter design:
- <1psRMS random jitter (RJ)
- <10psPP total jitter (clock)
- Internal input termination
- Patent-pending input termination and VT pin accepts AC- and DC-coupled inputs (CML, PECL, LVDS)
- 800mV LVPECL output swing
- CMOS/TTL-compatible output enable (EN) and divider select control
- Power supply 2.5V +5% or 3.3V +10%
- -40°C to +85°C industrial temperature range
- Available in 32-pin QFN package
Applications:
- All SONET and GigE clock distribution
- All Fiber Channel Clock and data distribution
- Network routing engine timing distribution
- High-end, low-skew multiprocessor synchronous clock distribution
Available Packaging
Package Qty:
60 per Tube
Package Style:
MLF-32
Mounting Method:
Surface Mount