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Manufacturer Part #
MX25L25645GM2I-10G
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92 per Tube
SOP-8
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Subject: Change lead frame and die attach materials for LINGSEN SOP8 209mil package products. Change Category : Assembly material Description:Before Change : (a) Lead-frame material: Copper (FS) (b) Die attach material: EM700 (Nitto) After Change : (a) Lead-frame material: Copper (AAMI) (b) Die attach material: HR-9004 (Resonac) Reason of Change: Due to lead frame tooling wear-out for the affected products, the lead frame material will be changed to an alternative material, and the die attach film material will be adjusted accordingly. Schedule: New material sample available date: Apr. 15, 2026 1st shipping date: Aug. 1, 2026 (Or follow PCN agreement with the customer) (Note: During the transition period, a mixture of old and new materials may be used until existing inventory is depleted.)
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.